Broadcom Announces First Gigabit MoCA 2.0 Single Chip Solution
LAS VEGAS, Jan. 8, 2013 /PRNewswire via COMTEX/ --
- 2013 CES International -
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a single-chip one Gigabit MoCA 2.0 solution, enabling operators to deliver advanced MoCA 2.0 functionality into the full spectrum of broadband devices. Designed for applications such as cable, DSL or gigabit passive optical network (GPON) modems, routers, bridges or access points, the Broadcom BCM6802 MoCA 2.0 system-on-a-chip (SoC) delivers up to gigabit speeds of home network bandwidth for enhanced whole-home video quality and distribution. Learn how Broadcom® innovation is enabling the Connected Life at home, at work, and on-the-go at Broadcom@CES.
"Broadcom is leading the design and acceleration of deployments of MoCA 2.0 products and technology to create whole-home connected TV experiences," said Dan Marotta, Broadcom Executive Vice President and General Manager, Broadband Communications Group. "This standalone solution is the next step in broadly transitioning operators from earlier generations of the standard to today's more sophisticated home networking requirements, enabling high-quality broadcast content delivery to TVs, tablets, laptops and smartphones - anywhere in the home."
MoCA 2.0 is the most current evolution of the MoCA standard with the ability to bond two channels together for a richer home networking experience, enabling operators to integrate more advanced features such as higher throughput, more channels and more user endpoints. In addition to increased throughput, MoCA 2.0 implementations benefit from the standard's advanced power management and support for higher levels of security for enhanced content protection. MoCA 2.0 is supported by top operators across North America including Charter, Cogeco, Comcast, Cox Communications, DIRECTV, DISH Network, Rogers Communications Inc., Time Warner Cable and Verizon's FiOS services.
-- Channel bonding to support 800Mbps over 16 nodes and up to 1Gbps for channel bonded turbo mode.
-- Advanced network power management and power savings modes.
-- Standalone and companion SoC modes of operation.
-- Integrated memory for low bill of material (BOM) cost.
-- Driver support for cable, DSL and access point platforms.
The Broadcom BCM6802 MoCA 2.0 SoC is now sampling and will be demonstrated at Broadcom's Booth at 2013 CES International.
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Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by connecting everything®. For more information, go to www.broadcom.com.
Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.
Dana Brzozkiewicz Chris Zegarelli
Public Relations Manager Senior Director, Investor Relations
SOURCE Broadcom Corporation; BRCM Broadband
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