[August 03, 2026]

Kioxia Showcases Game Changing Flash Storage Innovations for the AI Era at FMS 2026

This week at FMS: the Future of Memory and Storage, KIOXIA America, Inc. will demonstrate how its flash memory and SSD technologies, including the KIOXIA GP1 Series PCIe^® 6.0 NVMe™ SSD optimized for GPU direct access, enable the next generation of AI infrastructure. Through a keynote presentation, executive panel discussions, technical sessions, and technology demonstrations, the company will showcase the innovations driving the performance, scalability, and efficiency required for next-generation AI infrastructure.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260803123361/en/

Kioxia experts will share insights throughout FMS on the technologies shaping the future of AI infrastructure, including flash memory, SSDs, computational storage, CXL interface, NVMe protocol, and other next-generation storage architectures.

As AI adoption accelerates, memory and storage have become foundational to delivering the speed, scale, and efficiency modern AI workloads demand. From enterprise AI and cloud infrastructure to high-performance computing and emerging AI architectures, Kioxia continues to help organizations overcome performance bottlenecks, improve energy efficiency, and scale AI deployments more effectively.

Featured at FMS 2026 are the recently announced KIOXIA CM10 Series PCIe^® 6.0 enterprise SSDs and KIOXIA NX1 Series SSDs, both of which support direct liquid cooling. Designed for AI and modern data center environments, KIOXIA CM10 Series SSDs are the first enterprise drives built with BiCS FLASH™ generation 10 flash memory, and the KIOXIA NX1 Series represents a new generation of E1.S PCIe5.0 NVMe™ data center SSDs.

"AI is rapidly evolving across every industry, and memory is at the center of that transformation," said Scott Nelson, Executive Vice President and Chief Marketing Officer for KIOXIA America, Inc. "At Kioxia, we're enabling the next generation of AI with flash memory and storage technologies that deliver the performance, density, and efficiency organizations need. From the data center to the edge, our innovations are a game changer, helping power the AI applications transforming how businesses operate and compete."

Kioxia experts will share insights throughout the week on the technologies shaping the future of AI infrastructure, including flash memory, SSDs, computational storage, CXL^® interface, NVMe protocol, and other next-generation storage architectures.

Keynote Presentation:
"Redefining Data Center Storage for the AI Era with Flash Memory and SSDs"
Tuesday, August 4 at 11:10 am
Neville Ichhaporia, Senior Vice President and General Manager of the SSD Business Unit, and Katsuki Matsudera, General Manager of the Memory Technical Marketing Managing Department, will present this keynote session. The presentation will explore how AI's shift from model training to inference is transforming data center design and driving new requirements for memory and storage. They will discuss the latest advancements in KIOXIA BiCS FLASH 3D memory, SSD technologies, and software designed to optimize AI-centric data centers.

NVIDIA Special Session:
"Balancing Memory and Storage to Operate AI Factories and Agents at Scale"
Thursday, August 6 at 11:00 am
This one-hour session will begin with a brief presentation from NVIDIA, followed by a panel discussion featuring NVIDIA and industry leaders, and conclude with audience Q&A. The session will explore how organizations can balance memory and storage to efficiently operate AI factories and AI agents at scale.

Panel Discussion:
"Storage in Accelerator-Centric Architectures"
Thursday, August 6 at 9:45 am
Ilya Cherkasov, Principal Engineer, Enterprise Division, SSD, will participate in this panel discussion examining how storage is evolving alongside GPU- and accelerator-centric AI architectures. Industry experts will discuss advancements in peer-to-per storage technologies, GPU-Direct Storage, NVMe innovations, and emerging AI storage ecosystems.

Technical Speaking Sessions
Tuesday, August 4
Flash Technology
8:35 am
DNN-based Read Flow for NAND Flash Memory Controllers
Speaker: Eyal Nitzan
• DNN-based read flow dynamically adapts read thresholds to improve NAND flash performance and throughput.

Computational Storage
8:50 am
Fixed Function Compute Standardization
Speaker: Devesh Rai
• Standardizing SSD compute offload capabilities for RAID, hashing, compression, and future storage services.

Testing & Performance
9:05 am
High IOPS SSD Emulation
Speaker: Rory Bolt
• High-speed SSD emulation supporting NVIDIA Storage-Next™ (NVIDIA SCADA architecture™) testing environments.

CXL
9:50 am
Advancing Tiered Memory Solutions with DAMON Enhancements for CXL Attached Flash
Speaker: Mahinder Saluja
• Linux^® DAMON enhancements improve management of CXL attached flash memory for AI and HPC workloads.

AI & ML Applications
9:50 am
GPU Direct Access to Storage SCADA
Speaker: Mike Klemm
• GPU-initiated storage access and SSD design considerations for NVIDIA Storage-Next workloads.

Wednesday, August 5
Flash Technology
8:45 am
Unlocking QLC Performance and Scalability
Speaker: Hadi Sayed
• Mixed-media SSD architectures combine SLC and QLC storage to improve performance and efficiency.

SSD Technology
9:20 am
A Case for Leveraging CMB to Access Underutilized SSD DRAM Memory Bandwidth
Speaker: Mahinder Saluja
• Unlocking unused SSD DRAM bandwidth through NVMe Controller Memory Buffer (CMB) and System Local Memory.

SSD Technology
10:05 am
Protecting Large Capacity Drives
Speaker: Mike Klemm
• Strategies for protecting next-generation high-capacity SSDs and improving recovery from die failures.

Networks & Connections
10:35 am
AiSAQ™: Enabling Ultra-High-Scale RAG with Cost-Efficient All-in-Storage ANNS and GPU-Accelerated Indexing
Speaker: Mahinder Saluja
• Cost-efficient all-in-storage vector search for ultra-large RAG deployments with GPU-accelerated indexing.

Storage Tiering
10:35 am
The Opportunity for Nearline SSD for HDD Displacement
Speaker: Rory Bolt
• Market opportunities, standards, and TCO advantages for nearline SSD adoption.

Networks & Connections
3:35 pm
NVMe Technology: The Command Set for High Bandwidth AI, Cloud and Enterprise Applications
Speaker: Fred Knight
• Latest NVMe standards roadmap and new protocol capabilities supporting AI, cloud, and enterprise workloads.

Thursday, August 6
Data Center Storage & Memory
9:50 am
Liquid Cooling for SSDs - Challenges and Opportunities
Speaker: Rory Bolt
• Emerging liquid cooling standards and implications for AI-optimized SSD design.

Networks & Connections
10:35 am
UFS 5.0 Architecture for On-Device Generative AI Systems
Speaker: Kevin Hsu
• UFS 5.0 architecture enables higher bandwidth and lower latency for on-device generative AI.

KIOXIA Booth Demos

Product and technology demonstrations will be given on the show floor in the iconic 2-level Kioxia booth #307 - featuring ten separate exhibit locations - and include:

• Liquid Cooling SSDs for AI - featuring KIOXIA NX1 Series Data Center NVMe SSDs
• Context Memory Caching for Maximizing AI Inferencing - featuring KIOXIA CM9 Series Enterprise NVMe SSDs
• PCIe 6.0 NVMe Enterprise SSDs - featuring KIOXIA CM10 Series Enterprise NVMe SSDs
• KIOXIA GP1 Series Super High IOPS SSD - 10 million IOPS in 512-byte random read performance for near GPU Workloads
• AI RAG: Improving Scalability for Vector Databases - featuring KIOXIA AiSAQ™ open source software
• High Capacity QLC Storage for Fast Retrieval of Large Datasets - featuring 245.76 TB KIOXIA LC9 Series NVMe SSDs
• New UFS 5.0: AI Ready, High Performance Memory Solutions
• CXL Memory Module with KIOXIA XL-FLASH™ - expanding the memory hierarchy with XL-FLASH
• BiCS FLASH generation 10 Flash Memory - advanced scaling with CMOS directly Bonded to Array (CBA) technology, featuring 332 layers with enhanced lateral shrink
• High Capacity Package/Low Latency QLC Flash Memory - featuring a 32-die stack BGA package for AI applications

For more information, please visit www.Kioxia.com, and follow the company on X and LinkedIn^®.

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of Kioxia Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). From the invention of flash memory to today's breakthrough BiCS FLASH™ 3D technology, Kioxia continues to pioneer innovative memory, SSD and software solutions that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, automotive systems, data centers and generative AI systems. For more information, please visit KIOXIA.com.

© 2026 KIOXIA America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Kioxia product specifications.

Related Links:

FMS 2026 Official Site

Storage Solutions Empowering AI

Notes:

Definition of capacity: Kioxia Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2^30 bytes = 1,073,741,824 bytes and 1TB = 2^40 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

NVMe is a registered or unregistered mark of NVM Express, Inc. in the United States and other countries.

PCIe is a registered trademark of PCI-SIG.

CXL and Compute Express Link are trademarks of the Compute Express Link Consortium, Inc.

Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. Due to its serial interface, UFS supports full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

LinkedIn is a trademark of LinkedIn Corporation and its affiliates in the United States and/or other countries.

Other company names, product names and service names may be trademarks of third-party companies.

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