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Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC
[January 08, 2019]

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5.0 Dual-Mode Audio/Voice SoC


Cadence Design Systems (News - Alert), Inc. (NASDAQ: CDNS) today announced that Optek, a fabless semiconductor company delivering multimedia audio products, has selected the Cadence® Tensilica (News - Alert)® HiFi 3 DSP for its latest OTK528X Bluetooth 5.0 dual-mode audio/voice system on chip (SoC). Optek's customers can take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices. In addition to the audio and voice functions, Optek implemented the latest Bluetooth 5.0 dual-mode protocol stack and profiles on the HiFi 3 DSP to create a leading integrated audio SoC.

"Optek has been using the Tensilica HiFi DSPs for more than 10 years. HiFi DSPs have enabled us to achieve successful customer engagements based on excellent performance and the comprehensive ecosystem that offers an extensive range of audio/voice software," said Alan Gu, vice president at Optek. "Using a single system software architecture based on the Tensilica processor for both the controller and DSP simplifies product development and reduces workload. Today's customers are looking for high-performance, power-efficient DSPs that offer a more user-friendly experience, especially in Bluetooth audio streaming. The HiFi DSP and Xtensa processor from Cadence will enable us to offer increased value to our customers."

The Cadence HiFi 3 DSP is the most energy-efficient DSP for channel and object-based audio codecs and post-processing, voice codecs and voice pre-processing. To provide their customers with the benefit of a ingle software architecture, Optek also implemented the configurable and customizable Tensilica Xtensa® processor core, which offers an architecture that can be optimized to the demand of the applications without redundancy and allows Optek to use a single product for multiple markets.



"The combination of the HiFi 3 DSP and Xtensa controller offers Optek a highly integrated single-microarchitecture solution to create a competitive SoC product with leading performance and energy efficiency," stated Yipeng Liu, technical marketing director, audio/voice IP at Cadence. "The HiFi 3 DSP efficiently supports the audio and voice codecs and processing and is the best suited DSP for a wide range of Bluetooth audio and voice applications."

Tensilica HiFi DSPs are the most widely licensed audio/voice/speech processors, with support for over 300 proven software packages and more than 125 software partners in the Tensilica Xtensions partner program. More than 100 top-tier semiconductor companies and system OEMs have selected Tensilica HiFi DSPs for their audio, voice and speech products. For more information on the Tensilica HiFi DSP family, visit http://ip.cadence.com/ipportfolio/tensilica-ip/audio.


About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company's System Design Enablement strategy helps customers develop differentiated products-from chips to boards to systems-in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at cadence.com.

© 2019 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective holders.


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