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Fabric.AI and Kopin Publish Joint White Paper on MicroLED Optical Interconnect Technology for Next-Generation AI Data CentersMassively parallel architecture enables sub-picojoule-per-bit efficiency — a fraction of the energy consumed by conventional interconnects, with direct implications for data center power and cooling costs The paper details how MicroLED optical links offer a roadmap to 20 Tb/s — scaling by channel count rather than lane speed as copper and laser-based optics approach physical limits NEW YORK, NY, Aug. 03, 2026 (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (Nasdaq: FABC), a fabless semiconductor company, and Kopin Corporation (Nasdaq: KOPN), a leading developer of microdisplay and MicroLED technology — joint developers of the Neural I/o™ MicroLED-based optical interconnect technology — today announced the publication of a jointly authored white paper, "Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure," examining why data movement — not compute — has become the primary constraint on AI infrastructure, and how MicroLED optical interconnects address it. The publication follows the companies' ongoing collaboration to commercialize Neural I/o™, a MicroLED-based optical interconnect platform designed to address the growing bandwidth and energy demands of next-generation AI infrastructure. The white paper outlines the technical and architectural principles underpinning that platform and explains why MicroLED-based optical interconnects may offer a more scalable and energy-efficient alternative as conventional interconnect technologies approach their physical limits. The white paper is available here. AI clusters now link tens of thousands of accelerators, and cluster performance is increasingly set by the interconnect rather than the processor. The white paper presents an architectural comparison of copper, laser-based optical, and MicroLED optical interconnects, and details how the MicroLED approach — moving data over hundreds to thousands of simple, low-power parallel channels instead of a few high-speed serial lanes — enables sub-picojoule-per-bit efficiency while scaling aggregate link bandwidth toward 20 Tb/s and beyond on published industry roadmaps. Key topics covered in the white paper include:
"Every conversation about AI infrastructure eventually arrives at the same bottleneck: moving data between chips," said Josh Silverman, Fabric.AI Chief Executive Officer. "We wrote this paper with Kopin to give investors, operators, and engineers a clear, honest framework for understanding why interconnects have become AI’s primary bottleneck — and why an architecture built on parallelism rather than lane speed is the path through that bottleneck. It reflects the thesis behind Neural I/o™, the platform we are developing together." Fabric.AI (Nasdaq: FBIC) is developing next-generation AI infrastructure technologies designed to overcome the bandwidth, latency, and power limitations of conventional computing architectures. The Company's proprietary Neural I/o™ platform leverages MicroLED-based optical interconnect technology to enable ultra-high-speed, energy-efficient communication between AI accelerators, processors, memory, and networking systems, supporting the growing demands of large-scale AI training and inference. Through strategic collaborations with industry leaders and a focus on scalable, high-performance connectivity solutions, Fabric.AI is advancing technologies that have the potential to improve the efficiency, performance, and economics of next-generation AI data centers and high-performance computing environments. For more information, visit Fabric.AI. About Kopin Corporation For more information, please visit Kopin’s website at www.kopin.com. Kopin is a trademark of Kopin Corporation. Forward-Looking Statements IR Contact: Media Contact: 
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