Telecom Platform Deployment Featured Article

ADLINK Technology (News - Alert), a manufacturer of high-performance PC-based add-on cards and a telecom platform deployment provider, is set to unveil some new products at this year’s Embedded World in Nuremberg.

Some of the innovative products to be showcased at the show include ATCA, CompactPCI (News - Alert), COM Express and COM products.

ADLINK’s advanced telecom platform solutions are designed for next-generation tele/data-communications equipment manufacturers and have high-density processing power and fast data throughput.

The telecom platform company based its latest ATCA processor blades on the future Intel (News - Alert) Xeon processor E5 family. The processor blades provide 10 Gigabit Ethernet, eight memory sockets for up to 128GB of DDR3, and dual 10GBASE-KXK Fabric Interface channels.

The company will also introduce its new complete line of 3U and 6U CompactPCI blades along with various peripheral cards and PMC modules. The new features will provide cost-effective, high performance platforms for telecommunications, military, and industrial automation applications.

In addition, ADLINK will unveil its latest CompactPCI offerings based on the future third-generation Intel Core processor. These offerings will support dual channel DDR3 ECC memory, three independent displays (DisplayPort, DVI, HDMI, VGA), USB 3.0, PCI (News - Alert) Express Gen3, remote management and Trusted Platform Module (TPM).

Other products to be displayed at Embedded World 2012 include:

• Express-HR: Intel Core i7/i5 Processor (News - Alert) on COM Express Type 6
• Express-LPC: Intel Atom on COMExpress Type 2
• nanoX-TC: Intel Atom on COM Express Type 10
• nanoX-ML: Intel Atom on COM Express Type 1
• CoreModule 745: Intel Atom on PC/104-Plu
•  ReadyBoard 740: Intel Atom on EPIC
•  MI-220: Intel Core i7/i5/i3 Processor on Mini-ITX
• COM Express nanoX Starter Kit
• COM Express Type 2 Starter Kit

See the newly launched ADLINK products at the Exhibition Center in booth #532 in Hall 1 at Embedded World 2012 until March 1.