Semiconductor packaging materials market to grow by USD 10,158.72 million from 2022 to 2027; The rise in global demand for consumers drives growth - Technavio
NEW YORK, Aug. 17, 2023 /PRNewswire/ -- The semiconductor packaging materials market is expected to grow by USD 10,158.72 million from 2022 to 2027, according to Technavio. As per the latest report, the market will progress at a CAGR of 6.06% during the forecast period. The increase in the adoption of semiconductor ICs for automobiles and the shift toward copper as bonding wire material is an emerging market trend. The rising need for semiconductor wafers is due to the automation and electrification of automobiles. Anti-lock braking systems, car navigation, airbag control, GPS, and display, power doors and windows, collision detection technology, infotainment, and automated driving are some of the major benefits. Hence, such factors drive the growth of the market during the forecast period. View a Sample Report within minutes!
Semiconductor Packaging Materials Market 2023-2027: Scope
Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. Our semiconductor packaging materials market report covers the following areas:
Semiconductor Packaging Materials Market 2023-2027 : Segmentation
The organic substrates segment will be significant during the forecast period. The rising demand is since these materials are used these materials are base layers of individual semiconductor devices and ICs on which other layers are deposited to complete the circuit. Such materials are a part of the circuit, and it is important that these are efficient conductors of electricity and thinner core materials. Hence, such factors boost the segment growth during the forecast period.
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Semiconductor Packaging Materials Market 2023-2027: Market Dynamics
The rise in global demand for consumers drives market growth. The market growth can be attributed to factors such as the rise in the sales of smart devices such as smartwatches, smartphones, and smart bands globally. Resultantly, it has fuelled the growth of semiconductor packaging materials. Some of the key applications of IC and semiconductors include Tablets and smartphones. Hence, such factors boost the market growth of the semiconductor packaging materials market during the forecast period.
Regulations associated with semiconductor packaging materials challenge market growth. Complying with strict material specifications set down by packaging assemblers and testers is a major challenge. Packaging chemical and materials suppliers are facing increased environmental regulations, especially in developing countries because there is a growing concern for environmental hazards related to packaging. Hence, such challenges impede the market growth during the forecast period.
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Semiconductor Packaging Materials Market 2023-2027: Company Analysis
We provide a detailed analysis of around 25 companies operating in the Semiconductor Packaging Materials Market, including some of the companies such as Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc. Backed with competitive intelligence and benchmarking, our research reports on the Semiconductor Packaging Materials Market are designed to provide entry support, customer profile, and M&As as well as go-to-market strategy support.
Semiconductor Packaging Materials Market 2023-2027: Key Highlights
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Table Of Contents :
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Material
7 Market Segmentation by End-user
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
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