Semiconductor Advanced Packaging Market to grow by USD 21,157.5 million from 2022 to 2027|Complexity of semiconductor IC is one of the market drivers - Technavio
NEW YORK, July 7, 2023 /PRNewswire/ -- The semiconductor advanced packaging market is set to grow by USD 21,157.5 million from 2022 to 2027 progressing at a CAGR of 8.5% during the forecast period. The report offers an up-to-date analysis regarding the current global market scenario, the latest trends and drivers, and the overall market environment. The complexity of semiconductor IC designs is the major factor notably driving the global semiconductor advanced packaging market growth. The number of characteristics and applications delivered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their offerings from those of their competitors. Hence, there has been a rising requirement for multifunctional ICs. Semiconductor device manufacturers have addressed this need by developing new and more complicated architecture and designs for semiconductor ICs. For instance, the development of 3D ICs, which are compact, consume less power and are highly efficient but also have complicated designs and elaborate manufacturing processes. Foundries must invest in the latest equipment to develop advanced production systems in line with the latest developments in the packaging field with the rising complexity of IC design and manufacturing processes. Leading foundries such as TSMC require to guarantee not only the continuous upgrade of their production equipment but also that their packaging systems can carry out production using the latest technologies. Such factors are anticipated to propel the growth of the market during the forecast period. Here is an Exclusive report talking about Market scenarios with a historical period (2017-2021) and a forecast period (2023-2027). Download Sample Report in minutes!
The semiconductor advanced packaging market covers the following areas:
The report on the semiconductor advanced packaging market provides a holistic update, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis.
Semiconductor Advanced Packaging Market 2023-2027 - Market Dynamics
The integration of semiconductor components in vehicles is an emerging trend supporting the advanced semiconductor packaging market growth. The increasing demand for automation in vehicles as well as the electrification of automobiles, is driving the semiconductor market in this sector. Semiconductor ICs are being used for different purposes in automobiles, such as airbag control, GPS, anti-lock braking systems, displays, infotainment systems, power doors as well as windows, automated driving, and collision detection technology. Moreover, the requirement for these semiconductor devices to be of small size and the right form factor will fuel the demand for advanced packaging solutions from the automotive sector. Also, rising yearly car production numbers generate significant demand for semiconductor devices will have a positive impact on the market growth. Autonomous vehicles incorporate several electronic systems, such as forward collision warning, lane departure warning, smart cameras, and autonomous braking systems and as a result, there is a high demand for automotive ICs such as MCUs, MPUs, memory devices, power management ICs, and radar and RF modules. This, in turn, will boost the growth of the market during the forecast period.
Increased production costs are a major challenge hindering the global semiconductor advanced packaging market growth. Wrapping is one of the factors increasing the production cost. The non-availability of a specific solution to the problem of warping augments the production costs for participants in the market, which, in turn, limits the growth of the market. However, a warpage is described as a distortion where the surface of the molded part does not follow the definite design. The issue of warping happens several times during advanced semiconductor packaging, which could result in the wastage of wafers and ultimately leads to high costs. For example, the issue of warping can happen after the post-module of the reconstituted wafer and also occur after the back grinding of the epoxy mold compound to expose the copper contact pad. Such factors are anticipated to impede the growth of the semiconductor advanced packaging market during the forecast period.
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Semiconductor Advanced Packaging Market 2023-2027: Market Segmentation
The semiconductor advanced packaging market segmentation by type (analog and mixed ICs, MEMs and sensors, logic and memory devices, wireless connectivity devices, and CMOS /image sensors), technology (flip chip, FI WLP, 2.5D/3D, and FO WLP), and geography (APAC, North America, Europe, South America, and Middle east and Africa).
This report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources through an analysis of key parameters- View Sample Report
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Key Topics Covered:
1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation by Type
7 Market Segmentation by Technology
8 Customer Landscape
9 Geographic Landscape
10 Drivers, Challenges, and Trends
11 Vendor Landscape
12 Vendor Analysis
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