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DNP Develops TGV Glass Core Substrate for Semiconductor PackagesDai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces conventional resin substrates (ex. FC-BGA: Flip Chip-Ball Grid Array) with a glass substrate. Through the use of high-density Through Glass Via (TGV), it is now possible to provide a higher performance semiconductor package than that based on currently available technology. In addition, by adapting our panel manufacturing process, the new product can also support demands for high efficiency and large-scale substrate. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230314005568/en/
[Features]
• High aspect ratio and large-scale
[Going Forward]
About DNP DNP was established in 1876, and has become a leading global company that leverages print-based solutions and the strengths of its growing number of partners to engineer fresh business opportunities while protecting the environment and creating a more vibrant world for all. We capitalize on core competencies in microfabrication and precision coating technology to provide products for the display, electronic device, and optical film markets. We have also developed new products, such as vapor chamber and reflect array that offer next-generation communication solutions for more people-friendly information society.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230314005568/en/ |