Insights on the Outsourced Semiconductor Assembly and Testing Global Market to 2031 - by Process, Packaging Type, Application and Region
Dublin, Jan. 30, 2023 /PRNewswire/ -- The "Outsourced Semiconductor Assembly and Testing Market By Process, By Packaging Type, By Application: Global Opportunity Analysis and Industry Forecast, 2021-2031" report has been added to ResearchAndMarkets.com's offering.
The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031.
Outsourced semiconductor assembly and test (OSAT) are the number of companies that offers third-party IC-packaging as well as test services. IDMs and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations.
OSAT mainly emphasizes on providing advanced packaging as well as test solutions for semiconductor companies in various markets such as consumer goods, communications, and computing along with emerging markets such as Internet of Things (IoT), automotive electronics, and wearable devices.
Key Benefits For Stakeholders
CHAPTER 1: INTRODUCTION
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