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Radisys Announces Next Generation Connect 5G RAN CU/DU Software Support for Qualcomm FSM200xx 5G RAN PlatformRadisys® Corporation, a global leader of open telecom solutions, today announced that its award-winning, Release 16 compliant, Connect RAN 5G CU/DU software will be integrated with the Qualcomm® FSM™200xx 5G RAN Platform for Small Cells to enable high capacity multi-band and multi-carrier 5G RAN solutions. 5G small cell solutions have been gaining traction as a way to enable additional capacity and coverage to networks when and where needed - both indoors and outdoors - due to their ease of installation and management. The integration of Radisys' feature-rich 5G RAN CU/DU software will help enable OEMs to accelerate time-to-market for solutions based on Qualcomm Technologies' latest small cell platform. News Highlights
Munish Chhabra, SVP and general manager of Mobility Software and Services Business, Radisys, says: "Radisys is excited to continue its collaboration with Qualcomm Technologies to develop next-generation 5G RAN solution based on the Qualcomm FSM200xx 5G RAN Platform with Radisys Connect RAN Release 16 software. This solution will act as a catalyst for development and deployment of FR1/FR2 small cells extending the high capacity mobile broadband use cases to other verticals." Meet with Radisys at MWC Las Vegas Experience Radisys' disaggregated RAN solutions, including presentations and demonstrations of Connect 5G RAN software, at MWC Las Vegas, booth W2.937. To schedule a meeting with Radisys' RAN experts, contact [email protected]. About Radisys Radisys, a global leader in open telecom solutions, enables service providers to drive disruption with new open architecture business models. Radisys' innovative disaggregated and virtualized enabling technology solutions leverage open reference architectures and standards, combined with open software and hardware to power business transformation for the telecom industry, while its world-class services organization delivers systems integration expertise necessary to solve communications and content providers' complex deployment challenges. For more information, visit www.radisys.com. Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners. Qualcomm and FSM are trademarks or registered trademarks of Qualcomm Incorporated. Qualcomm FSM is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
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