Advanced Packaging Technologies Global Market Report to Reach $8.95 Billion by 2026 at a CAGR of 11.9%
DUBLIN, Aug. 18, 2022 /PRNewswire/ -- The "Advanced Packaging Technologies Global Market Report 2022" report has been added to ResearchAndMarkets.com's offering.
The global advanced packaging technologies market is expected to grow from $5.03 billion in 2021 to $5.71 billion in 2022 at a compound annual growth rate (CAGR) of 13.7%. The market is expected to grow to $8.95 billion in 2026 at a compound annual growth rate (CAGR) of 11.9%.
Electronic devices must give more functionality with more processing power and faster speeds, resulting in increased module complexity. Advanced packaging technologies provide very reliable materials, function well, and are minimal in cost. For instance, global consumer electronics revenues are prdicted to expand by 3.6% year over year (YoY) to $1.06 trillion in 2021. Additionally, according to the India Brand Equity Foundation (IBEF) report, in 2019, the Indian appliance and consumer electronics (ACE) industry were valued at $10.93 billion (Rs. 76,400 crores), and it is predicted to double by 2025, reaching $ 21.18 billion (Rs. 1.48 lakh crore). Therefore, the growing demand for consumer electronics propels the growth of the advanced packaging market.
The growing technological advancements are shaping the advanced packaging technologies market. Major companies operating in the advanced packaging technologies sector are focused on developing technological solutions for advanced packaging to expand their leadership in semiconductor solutions. For instance, in May 2021 Samsung Electronics, a South Korea-based electronics company launched Interposer-Cube4 (I-Cube4), an advanced chip packaging technology for high-performance applications. Interposer-Cube4 (I-Cube4), a 2.5D packaging technology improves communication and power effectiveness among logic and memory chips and is projected to be widely used in sectors such as high-performance computing, artificial intelligence (AI), 5G, cloud, and the largest data center applicants.
7. Advanced Packaging Technologies Market Regional And Country Analysis
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