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Flip Chip Market Size to Grow by USD 9.1 billion, 39% of Market Growth to Originate from APAC - Technavio
[July 28, 2022]

Flip Chip Market Size to Grow by USD 9.1 billion, 39% of Market Growth to Originate from APAC - Technavio


NEW YORK, July 28, 2022 /PRNewswire/ -- Flip chip technology is an advanced packaging method that uses conductive bumps to interconnect the chip and the substrate. It provides better performance when compared to conventional wire bonding.

The "Flip Chip Market by End-user (electronics, heavy machinery and equipment, IT and telecommunication, automotive, and others) and Geography (North America, APAC, Europe, MEA, and South America) - Forecast and Analysis 2021-2025" report has been added to Technavio's offering. The potential growth difference for the flip chip market size between 2020 and 2025 is USD 9.1 bn. To get the exact CAGR and the Y-O-Y growth rate, Request a Sample Report

Market Segmentation

The flip chip market report is segmented by end-user (electronics, heavy machinery and equipment, IT and telecommunication, automotive, and others) and geography (North America, APAC, Europe, MEA, and South America). 

By geography, APAC will be the leading region with 39% of the market's growth during the forecast period. China is a key country for the flip chip market in APAC. The growth of the region is attributed to factors such as the growing demand for flip chips from the automotive, aerospace, electronics and electrical, and telecommunication industries, especially in countries such as China, Japan, India, and South Korea. Moreover, market growth in this region will be faster than the growth of the market in other regions.

By end-user, the electronics segment will have significant market share growth during the forecast period. Flip chip packaging is used widely in the electronics industry. The demand for high-functionality ICs, the large number of input-output ports, and high-density packaging in electronics will drive the growth of the segment.

View our sample report to find out the contribution of all the segments and regional opportunities in the report.

Key Market Dynamics:

  • Market Driver: The high requirement from IoT is driving the growth of the market. The emergence of concepts such as smart manufacturing, smart factories, and smart grids has increased the demand for IoT devices. Incorporating smart grids with existing networks in developed countries will also raise the demand for IoT devices. Thus, the growing demand for IoT devices has increased the demand for sensors. Flip chip technology can be used to miniaturize equipment such as sensors and provide high performance. Hence, flip chip architecture is incorporated in microelectromechanical systems (MEMS) sensors, which is driving the growth of the global flip chip market.
  • Market Challenge: The need for significant capital investments is challenging the growth of the flip chip market. Significant capital investments are required to set up a manufacturing facility for flip chip technology for packaging services. Moreover, advanced safety features are needed in assembly lines to reduce malfunctions and stoppages. The implementation of such features is expensive. Hence, the need for significant capital investments will hinder the growth of the global flip chip market.

Technavio provides the latest drivers, trends, and challenges that help businesses gain a competitive edge. View our Sample Report

Some Companies Mentioned with their Offerings

  • ASE Technology Holding Co. Ltd.
  • Amkor Technology Inc.
  • Chipbond Technology Corp.
  • ChipMOS TECHNOLOGIES Inc.
  • Intel Corp.
  • International Business Machines Corp.
  • NXP Semiconductors NV
  • Samsung Electronics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor Manufacturing Co. Ltd.

This report provides a full list of key vendors, their strategies, and the latest developments. Request a Sample Report Now

Related Reports

System-on-Chip Market by Application and Geography - Forecast and Analysis 2022-2026

Chip-on-Board (COB) LED Market by Application and Geography - Forecast and Analysis 2022-2026





Flip Chip Market Scope

Report Coverage

Details

Page number

120

Base year

2020

Forecast period

2021-2025

Growth momentum & CAGR

Accelerate at a CAGR of 6.99%

Market growth 2021-2025

USD 9.1 billion

Market structure

Fragmented

YoY growth (%)

6.19

Regional analysis

North America, APAC, Europe, MEA, and South America

Performing market contribution

APAC at 39%

Key consumer countries

US, China, Germany, and Canada

Competitive landscape

Leading companies, competitive strategies, consumer engagement scope

Companies profiled

ASE Technology Holding Co. Ltd., Amkor Technology Inc., Chipbond Technology Corp., ChipMOS TECHNOLOGIES Inc., Intel Corp., International Business Machines Corp., NXP Semiconductors NV, Samsung Electronics Co. Ltd., Siliconware Precision Industries Co. Ltd., and Taiwan Semiconductor Manufacturing Co. Ltd.

Market Dynamics

Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and future consumer dynamics, and market condition analysis for the forecast period.

Customization purview

If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.


Key Topics Covered:

1 Executive Summary

2 Market Landscape

  • 2.1 Market ecosystem
    • Exhibit 01: Parent market
    • Exhibit 02: Market characteristics
  • 2.2 Value chain analysis
    • Exhibit 03: Value chain analysis: Semiconductors

3 Market Sizing

  • 3.1 Market definition
    • Exhibit 04: Offerings of vendors included in the market definition
  • 3.2 Market segment analysis
    • Exhibit 05: Market segments
  • 3.3 Market size 2020
  • 3.4 Market outlook: Forecast for 2020 - 2025
    • Exhibit 06: Global - Market size and forecast 2020 - 2025 ($ billion)
    • Exhibit 07: Global market: Year-over-year growth 2020 - 2025 (%)

4 Five Forces Analysis

  • 4.1 Five forces summary
    • Exhibit 08: Five forces analysis 2020 & 2025
  • 4.2 Bargaining power of buyers
    • Exhibit 09: Bargaining power of buyers
  • 4.3 Bargaining power of suppliers
    • Exhibit 10: Bargaining power of suppliers
  • 4.4 Threat of new entrants
    • Exhibit 11: Threat of new entrants
  • 4.5 Threat of substitutes
    • Exhibit 12: Threat of substitutes
  • 4.6 Threat of rivalry
    • Exhibit 13: Threat of rivalry
  • 4.7 Market condition
    • Exhibit 14: Market condition - Five forces 2020

5 Market Segmentation by End-user

  • 5.1 Market segments
    • Exhibit 15: End-user - Market share 2020-2025 (%)
  • 5.2 Comparison by End-user
    • Exhibit 16: Comparison by End-user
  • 5.3 Electronics - Market size and forecast 2020-2025
    • Exhibit 17: Electronics - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 18: Electronics - Year-over-year growth 2020-2025 (%)
  • 5.4 Heavy machinery and equipment - Market size and forecast 2020-2025
    • Exhibit 19: Heavy machinery and equipment - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 20: Heavy machinery and equipment - Year-over-year growth 2020-2025 (%)
  • 5.5 IT and telecommunication - Market size and forecast 2020-2025
    • Exhibit 21: IT and telecommunication - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 22: IT and telecommunication - Year-over-year growth 2020-2025 (%)
  • 5.6 Automotive - Market size and forecast 2020-2025
    • Exhibit 23: Automotive - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 24: Automotive - Year-over-year growth 2020-2025 (%)
  • 5.7 Others - Market size and forecast 2020-2025
    • Exhibit 25: Others - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 26: Others - Year-over-year growth 2020-2025 (%)
  • 5.8 Market opportunity by End-user
    • Exhibit 27: Market opportunity by End-user

6 Customer landscape

  • 6.1 Customer landscape
    • Exhibit 28: Customer landscape

7 Geographic Landscape

  • 7.1 Geographic segmentation
    • Exhibit 29: Market share by geography 2020-2025 (%)
  • 7.2 Geographic comparison
    • Exhibit 30: Geographic comparison
  • 7.3 North America - Market size and forecast 2020-2025
    • Exhibit 31: North America - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 32: North America - Year-over-year growth 2020-2025 (%)
  • 7.4 APAC - Market size and forecast 2020-2025
    • Exhibit 33: APAC - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 34: APAC - Year-over-year growth 2020-2025 (%)
  • 7.5 Europe - Market size and forecast 2020-2025
    • Exhibit 35: Europe - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 36: Europe - Year-over-year growth 2020-2025 (%)
  • 7.6 MEA - Market size and forecast 2020-2025
    • Exhibit 37: MEA - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 38: MEA - Year-over-year growth 2020-2025 (%)
  • 7.7 South America - Market size and forecast 2020-2025
    • Exhibit 39: South America - Market size and forecast 2020-2025 ($ billion)
    • Exhibit 40: South America - Year-over-year growth 2020-2025 (%)
  • 7.8 Key leading countries
    • Exhibit 41: Key leading countries
  • 7.9 Market opportunity by geography
    • Exhibit 42: Market opportunity by geography ($ billion)

8 Drivers, Challenges, and Trends

  • 8.1 Market drivers
  • 8.2 Market challenges
    • Exhibit 43: Impact of drivers and challenges
  • 8.3 Market trends

9 Vendor Landscape

  • 9.1 Vendor landscape
    • Exhibit 44: Vendor landscape
  • 9.2 Landscape disruption
    • Exhibit 45: Landscape disruption
    • Exhibit 46: Industry risks

10 Vendor Analysis

  • 10.1 Vendors covered
  • 10.2 Market positioning of vendors
    • Exhibit 48: Market positioning of vendors
  • 10.3 Amkor Technology Inc.
    • Exhibit 49: Amkor Technology Inc. - Overview
    • Exhibit 50: Amkor Technology Inc. - Business segments
    • Exhibit 51: Amkor Technology Inc. - Key News
    • Exhibit 52: Amkor Technology Inc. - Key offerings
    • Exhibit 53: Amkor Technology Inc. - Segment focus
  • 10.4 ASE Technology Holding Co. Ltd.
    • Exhibit 54: ASE Technology Holding Co. Ltd. - Overview
    • Exhibit 55: ASE Technology Holding Co. Ltd. - Business segments
    • Exhibit 56: ASE Technology Holding Co. Ltd. - Key News
    • Exhibit 57: ASE Technology Holding Co. Ltd. - Key offerings
    • Exhibit 58: ASE Technology Holding Co. Ltd. - Segment focus
  • 10.5 Chipbond Technology Corp.
    • Exhibit 59: Chipbond Technology Corp. - Overview
    • Exhibit 60: Chipbond Technology Corp. - Business segments
    • Exhibit 61: Chipbond Technology Corp. - Key offerings
    • Exhibit 62: Chipbond Technology Corp. - Segment focus
  • 10.6 ChipMOS TECHNOLOGIES Inc.
    • Exhibit 63: ChipMOS TECHNOLOGIES Inc. - Overview
    • Exhibit 64: ChipMOS TECHNOLOGIES Inc. - Business segments
    • Exhibit 65: ChipMOS TECHNOLOGIES Inc. - Key offerings
    • Exhibit 66: ChipMOS TECHNOLOGIES Inc. - Segment focus
  • 10.7 Intel Corp.
    • Exhibit 67: Intel Corp. - Overview
    • Exhibit 68: Intel Corp. - Business segments
    • Exhibit 69: Intel Corp. - Key News
    • Exhibit 70: Intel Corp. - Key offerings
    • Exhibit 71: Intel Corp. - Segment focus
  • 10.8 International Business Machines Corp.
    • Exhibit 72: International Business Machines Corp. - Overview
    • Exhibit 73: International Business Machines Corp. - Business segments
    • Exhibit 74: International Business Machines Corp. - Key News
    • Exhibit 75: International Business Machines Corp. - Key offerings
    • Exhibit 76: International Business Machines Corp. - Segment focus
  • 10.9 NXP Semiconductors NV
    • Exhibit 77: NXP Semiconductors NV - Overview
    • Exhibit 78: NXP Semiconductors NV - Business segments
    • Exhibit 79: NXP Semiconductors NV - Key offerings
  • 10.10 Samsung Electronics Co. Ltd.
    • Exhibit 80: Samsung Electronics Co. Ltd. - Overview
    • Exhibit 81: Samsung Electronics Co. Ltd. - Business segments
    • Exhibit 82: Samsung Electronics Co. Ltd. - Key offerings
    • Exhibit 83: Samsung Electronics Co. Ltd. - Segment focus
  • 10.11 Siliconware Precision Industries Co. Ltd.
    • Exhibit 84: Siliconware Precision Industries Co. Ltd. - Overview
    • Exhibit 85: Siliconware Precision Industries Co. Ltd. - Business segments
    • Exhibit 86: Siliconware Precision Industries Co. Ltd. - Key offerings
    • Exhibit 87: Siliconware Precision Industries Co. Ltd. - Segment focus
  • 10.12 Taiwan Semiconductor Manufacturing Co. Ltd.
    • Exhibit 88: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
    • Exhibit 89: Taiwan Semiconductor Manufacturing Co. Ltd. - Business segments
    • Exhibit 90: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings

11 Appendix

  • 11.1 Scope of the report
  • 11.2 Currency conversion rates for US$
    • Exhibit 91: Currency conversion rates for US$
  • 11.3 Research methodology
    • Exhibit 92: Research Methodology
    • Exhibit 93: Validation techniques employed for market sizing
    • Exhibit 94: Information sources
  • 11.4 List of abbreviations
    • Exhibit 95: List of abbreviations
About Us

Technavio is a leading global technology research and advisory company. Their research and analysis focus on emerging market trends and provide actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio's report library Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio's comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contact

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email:[email protected]
Website: www.technavio.com/

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