Outlook on the Organic Substrate Packaging Material Global Market to 2026 - by Technology, Application and Region
DUBLIN, Nov. 24, 2021 /PRNewswire/ -- The "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026" report has been added to ResearchAndMarkets.com's offering.
The global organic substrate packaging material market exhibited moderate growth during 2015-2020. Looking forward, the market is expected to grow at a CAGR of around 5% during 2021-2026. Keeping in mind the uncertainties of COVID-19, the analyst is continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.
Furthermore, the increasing adoption of self-driving vehicles is contributing to the market growth, as these materials are used in millimeter-wave automotive radar systems to detect obstacles. Moreover, the growing semiconductor industry, coupled with the escalating demand for improved electric motors in industrial equipment, is boosting the sales of organic substrate packaging materials around the globe. However, due to lockdowns imposed by governments of several countries as a preventive measure to contain the spread of the coronavirus disease (COVID-19), non-essential activities have been halted for a short period. This has disrupted the operational efficiency of various industries and negatively impacted the market growth. The market is expectd to experience growth once normalcy is regained.
The report has also analysed the competitive landscape of the market with some of the key players being Amkor Technology Inc., ASE Kaohsiung (Advanced Semiconductor Engineering Inc.), Compass Technology Co. Ltd., Hitachi Chemical Company Ltd. (Hitachi and Showa Denko), Kyocera Corporation, Mitsubishi Corporation, NGK Spark Plug Co. Ltd., Shinko Electric Industries Co. Ltd. (Fujitsu), STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.) and WUS Printed Circuit Co. Ltd.
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