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Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market to Reach $3.8 Billion by 2024SAN FRANCISCO, Aug. 11, 2021 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) - Global Market Trajectory & Analytics". The report presents fresh perspectives on opportunities and challenges in a significantly transformed post COVID-19 marketplace.
FACTS AT A GLANCE Complimentary Project Preview - This is an ongoing global program. Preview our research program before you make a purchase decision. We are offering a complimentary access to qualified executives driving strategy, business development, sales & marketing, and product management roles at featured companies. Previews provide deep insider access to business trends; competitive brands; domain expert profiles; and market data templates and much more. You may also build your own bespoke report using our MarketGlass™ Platform which offers thousands of data bytes without an obligation to purchase our report. Preview Registry ABSTRACT- Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market to Reach $3.8 Billion by 2024 Similarly, High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM memory. Made in a revolutionary vertically stacked onfiguration enabled by TSV technology, HBM extends much improved performance benefits as compared to conventional DRAM solutions. Key benefits of the HBM technology include vastly improved memory bandwidth, drastically reduced memory subsystem power, and smaller footprint, all of which potentially trigger large-scale, industry-wide innovation in DRAM memory vertical. HBM makes use of TSV technology and microbumps for interconnecting base die and DRAM die to build 1GB DRAM density per device. The model potentially brings new level of efficiency in CPUs, GPUs, FPGAs, and ASICs. Amid the COVID-19 crisis, the global market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) market is projected to reach US$3.8 Billion by 2024, registering a compounded annual growth rate (CAGR) of 28.7% over the analysis period. The United States represents the largest regional market for Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM), accounting for an estimated 49.0% share of the global total. The market is projected to reach US$2.1 Billion by the close of the analysis period. China is expected to spearhead growth and emerge as the fastest growing regional market with a CAGR of 36.2% over the analysis period. The market is growing at a steady pace driven by various growth encouraging factors. Massive adoption of electronics and digital technologies in consumer, commercial and industrial sectors on the back of widespread relevancy of 'Connected World' made possible with advanced communication protocols and enabling technologies and devices, is creating the persistent need for high-bandwidth, scalable and low power consuming memory solutions. Sustained expansion in world data center industry, on the back of steep increase in computing requirements of modern enterprises, is contributing immensely to growth and progress of HMC/HBM DRAM memory solutions. To resolve the soaring bandwidth and capacity requirements, modern data centers are increasingly relying on advanced technologies such as IoT, AI and cloud-based services, stirring the demand for sophisticated memory solutions in the process. Emergence of High-Performance Computing (HPC), referring to the application of supercomputers to resolve complex computational issues, as reliable tool for the worldwide IT industry is favouring widespread growth in HMC and HBM marketplace. Desktop computers usually require a single processing chip, generally called a CPU, however the processing chip requirement for HPC is excessively high, where HMC/HBM interfaces can be handy to resolve the underlying complexities. Steered by progressive developments in AI and ML, HPC gained traction in the last few years and the momentum in HPC is poised to remain northbound amid increasing computational power requirements of enterprises and general consumers, indicating strong growth forecasts for HMC/HBM DRAM memory solutions. Rising adoption of artificial intelligence (AI), broadly referring to the intelligence displayed by machines contrary to the natural intelligence demonstrated by humans, across various facets of technology applications is building momentum form high-tech memory devices. AI adoption is soaring on an ongoing basis amid escalating computational capacity in the 'Cloud', and improvements in sophisticated algorithms, while generating parallel opportunities to advanced hardware devices including high-performing memory and processors. Electronic device miniaturization is another major growth driver for HMC/HBM technology. As MEMS devices are small, they require advanced memory solutions made in extremely low-footprint designs, but with higher memory capacities, for which HMC/HBM can offer potential alternative. HMC and HBM market also stands to gain from high growth momentum in stacked DRAM vertical, gauged through wider uptake of 3D TSV technology in DRAM fabrication. Leading DRAM memory vendors are prioritizing 3D layer stacking with TSV technology to develop high-quality memory devices to address the growing high-performance computing needs of consumers, while creating ample space for HMC and HBM, the stacked DRAM memory solutions. More MarketGlass™ Platform Our platform is free for qualified executives and is accessible from our website www.StrategyR.com or via our just released mobile application on iOS or Android About Global Industry Analysts, Inc. & StrategyR™ CONTACTS: LINKS Connect With Us on LinkedIn Follow Us on Twitter Journalists & Media
SOURCE Global Industry Analysts, Inc. 
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