Insights on the Semiconductor Assembly and Packaging Services Global Market to 2027 - Featuring Amkor Technology, ASE Group and Intel Among Others
DUBLIN, Feb. 23, 2021 /PRNewswire/ -- The "Semiconductor Assembly and Packaging Services - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering.
The publisher brings years of research experience to the 6th edition of this report. The 142-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
The Semiconductor Assembly and Packaging Services market in the U.S. is estimated at US$1.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.5 Billion by the year 2027 trailing a CAGR of 4.5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.4% and 3.9% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.5% CAGR.
Industrial & Automotive Segment to Record 4.1% CAGR
In the global Industrial & Automotive segment, USA, Canada, Japan, China and Europe will drive the 4.2% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$557.1 Million in the year 2020 will reach a projected size of US$742.1 Million by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$942.9 Million by the year 2027.
Competitors identified in this market include, among others:
Key Topics Covered:
2. FOCUS ON SELECT PLAYERS
For more information about this report visit https://www.researchandmarkets.com/r/yo1wpg
Research and Markets
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