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Assessment of the Nokia 5G AirScale Digital Baseband Unit (BBU) 2020 - High Level Mechanical Analysis, PCB Analysis, and Bill of Materials
[July 07, 2020]

Assessment of the Nokia 5G AirScale Digital Baseband Unit (BBU) 2020 - High Level Mechanical Analysis, PCB Analysis, and Bill of Materials


DUBLIN, July 7, 2020 /PRNewswire/ -- The "Nokia 5G AirScale BBU" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

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This report provides a comprehensive analysis of the Nokia Networks 5G AirScale Digital Baseband Unit (BBU). The configuration of the 5G AirScale is:

  • AMIA Subrack
  • ASIK Common Plug In Unit
  • ABIL Capacity Plug In Unit

Features

  • System Functional Description
  • System Level Block Diagrams
  • High Level Mechanical Analysis
    • Heat Sink
  • High Level PCB Analysis
  • Component Diagrams
    • Semiconductor/component locations on PCB
  • High Level Bill of Materials
    • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
    • Passive/other components (Transformers, Power inductors, Power capaitors, power/datacom/optical connectors)
    • Complete Part Number/Marking
    • Component Manufacturer Identification
    • Function Component Description
    • Package Type



Key Topics Covered

EXECUTIVE SUMMARY


  • Active/Passive Component Summary
  • Important Note

CHAPTER 1: NOKIA AIRSCALE SYSTEM MODULE

  • Overview of AirScale BTS Portfolio

CHAPTER 2: AMIA SUBRACK

  • AMIA Guiderails
  • ASIx Blind Slot Frame
  • ABIx Blind Slot Frame
  • AMIA Chassis: External Views and Dimensions
  • AMIA Chassis: Backplane and Fan Units
  • AMIA Backplane

CHAPTER 3: ASIK PLUG IN UNIT

  • ASIK Front Panel & Handles
  • Power Supply Unit (PSU)
  • PSU Top Cover Heatsink
  • PSU Bottom FCTL Heatsink
  • PSU Printed Circuit Board Analysis
  • PSU Input DC Voltage Connector Assembly
  • PSU DC Busbar Assembly
  • ASIK FCTL PCB
  • eUSB Flash Card
  • OCXO Module
  • ASIK FCTL Bottom Cover

CHAPTER 4: ABIL

  • ABIL Front Panel
  • ABIL ASPA Heatsink
  • ABIL ASPA Cover
  • ABIL ASPA PCB

For more information about this report visit https://www.researchandmarkets.com/r/gsf5j5

Research and Markets also offers Custom Research services providing focused, comprehensive and tailored research.

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Cision View original content:http://www.prnewswire.com/news-releases/assessment-of-the-nokia-5g-airscale-digital-baseband-unit-bbu-2020---high-level-mechanical-analysis-pcb-analysis-and-bill-of-materials-301089038.html

SOURCE Research and Markets


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