Global $972M Die Bonder Equipment Market Insights & Opportunities, 2019-2024 - Increasing Demand for 3D Semiconductor Assembly & Packaging Spells Opportunity
DUBLIN, Nov. 29, 2019 /PRNewswire/ -- The "Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024" report has been added to ResearchAndMarkets.com's offering.
This report offers detailed insights into the die bonder equipment market based on type, bonding technique, supply chain participant, device, application, and region.
Die bonder equipment market is projected to grow at CAGR of 3.5% from 2019 to 2024
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