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Molex Showcases Expanded Portfolio of Next-Generation Optical Solutions at OFC 2019
[March 05, 2019]

Molex Showcases Expanded Portfolio of Next-Generation Optical Solutions at OFC 2019


Molex will feature several next-generation optical interconnect, wavelength management, optoelectronic and optical subsystem solutions for dynamic high-bandwidth telecommunications and network solutions at the Optical Networking and Communication Conference and Exhibition (OFC), March 5-7, 2019 at the San Diego (CA (News - Alert)) Convention Center in booth 2807.

"By combining our core technologies with additional complementary capabilities from our acquisitions and venture investments, we are proud to offer our customers a strong portfolio of innovative optical solutions to meet their needs today and in the future. At OFC 2019, we are excited to highlight those combined solutions including high-speed optical transceivers, flexible and scalable optical transport products, compact connectors and fiber management, which are all vital capabilities to building high-bandwidth and high-density communication equipment needed to serve telecom, enterprise and hyperscale data centers," said Doug Busch, vice president and general manager, optical solutions at Molex (News - Alert).

To help build the infrastructure of tomorrow's optical networks, Molex will feature several public and private demos, including:

  • OptoConnect Optical Enclosures - OptoConnect optical management solutions simplify complex fiber mapping while greatly reducing intra-system cabling footprints in advanced network architectures.
  • Fiber Management Solutions for COBO Based Optical Engines - A COBO* module-based reference layout board including high-density front panel Optical EMI shielding adapters, blind mating optical backplane interconnects and on-card optical cabling featuring FlexPlane technology will highlight how system vendors can implement COBO on board optical module-based architectures.
    *For more COBO-related information, visit the consortium for on board optics at booth 1817.
  • Dirac - Is the latest offering of high-port-count WSS for route-and-select architectures that demand 32+ ports.
  • BittWare, a Molex Company, will preview its SVL-29P - a PCIe board with dual 400G-compatible ports directly connected to a Xilinx (News - Alert) VU29P FPGA. This FPA utilizes the new 58 Gbps PAM-4 transceivers. The low-profile SVL-29P is an excellent board for those who want to get a head-start on 400G FPGA-based designs.
  • Molex will demonstrates interoperability of its 400G DR4, 100G optics modules and 3m QSFP-DD DAC cables with Cisco (News - Alert) N3432D-S switch, Innovium TERALYNXTM Switch and Keysight Technologies IXIA AresONE.



The following demos are by appointment only. Please contact Molex to schedule.

  • C+L band EDFA and Raman Amplifier will highlight how a compact, low-loss DGE can greatly reduce accumulated gain error, eliminate dynamic gain ripple and lower the noise figure.
  • Molex will demonstrate its coherent module capable to achieve 400G transmission and low power consumption. Performances under 16-QAM modulation at 60G baud rates will be shown in real-time for critical parameters.

Molex will also participate in speaking engagements:


  • In a session organized by the Consortium for On-Board Optics (COBO), Molex's Tom Marrapode will join other COBO members presenting on topics related to on board optical modules. This will include development in systems and sub-systems discussing both electrical and optical interconnects. The session will take place Wednesday, March 6, 2019 from 10:15-11:45AM in Theater II, Hall E.
  • Molex's Tom Strasser will teach the ever popular foundational course on Reconfigurable Networks, SC 261: ROADM (News - Alert) Technologies and Network Applications on Monday, March 4, 2019.

Molex joins other Optical Internetworking Forum (OIF) members attending OFC 2019 to showcase interoperability of Common Electrical Interface (CEI) solutions over a range of channel reaches and modulations. Live technology demonstrations featuring Molex solutions include:

  • Cables with Connector/Cage and Cables Demo
    A baseline draft of the CEI 112G LR Implementation Agreement has been developed. This demonstration, which establishes early stage feasibility for this topology, utilizes Molex's QSFP-DD (Double Density) passive copper cable.
  • CEI-112G-VSR SerDes with Module demo incorporates multiple silicon supplier products operating over a 112 Gbps PAM-4 VSR (chip-to-module) link. This demo utilizes Molex's QSFP-DD, a CEI-112G-VSR interface, to electrically drive interoperating HCB/MCB test boards.

Please visit the Molex booth at OFC 2019 or https://www.connector.com/solutions/ofc to explore a robust portfolio of next-generation, high-speed, high-density optical solutions. To learn more about how you can become a part of the Molex innovation, please visit booth 5349 in the Career Zone.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit www.molex.com.

Molex Resources:

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.


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