[March 05, 2019] |
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Molex Showcases Expanded Portfolio of Next-Generation Optical Solutions at OFC 2019
Molex will
feature several next-generation optical interconnect, wavelength
management, optoelectronic and optical subsystem solutions for dynamic
high-bandwidth telecommunications and network solutions at the Optical
Networking and Communication Conference and Exhibition (OFC), March 5-7,
2019 at the San Diego (CA (News - Alert)) Convention Center in booth 2807.
"By combining our core technologies with additional complementary
capabilities from our acquisitions and venture investments, we are proud
to offer our customers a strong portfolio of innovative optical
solutions to meet their needs today and in the future. At OFC 2019, we
are excited to highlight those combined solutions including high-speed
optical transceivers, flexible and scalable optical transport products,
compact connectors and fiber management, which are all vital
capabilities to building high-bandwidth and high-density communication
equipment needed to serve telecom, enterprise and hyperscale data
centers," said Doug Busch, vice president and general manager, optical
solutions at Molex (News - Alert).
To help build the infrastructure of tomorrow's optical networks,
Molex will feature several public and private demos, including:
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OptoConnect
Optical Enclosures - OptoConnect optical management solutions
simplify complex fiber mapping while greatly reducing intra-system
cabling footprints in advanced network architectures.
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Fiber
Management Solutions for COBO Based Optical Engines - A COBO*
module-based reference layout board including high-density front panel
Optical EMI shielding adapters, blind mating optical backplane
interconnects and on-card optical cabling featuring FlexPlane
technology will highlight how system vendors can implement COBO on
board optical module-based architectures.
*For more
COBO-related information, visit the consortium for on board optics at
booth 1817.
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Dirac
- Is the latest offering of high-port-count WSS for route-and-select
architectures that demand 32+ ports.
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BittWare,
a Molex Company, will preview its SVL-29P - a PCIe board with dual
400G-compatible ports directly connected to a Xilinx (News - Alert) VU29P FPGA. This
FPA utilizes the new 58 Gbps PAM-4 transceivers. The low-profile
SVL-29P is an excellent board for those who want to get a head-start
on 400G FPGA-based designs.
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Molex
will demonstrates interoperability of its 400G DR4, 100G optics
modules and 3m QSFP-DD DAC cables with Cisco (News - Alert) N3432D-S switch, Innovium
TERALYNXTM Switch and Keysight Technologies IXIA AresONE.
The following demos are by appointment only. Please contact Molex to
schedule.
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C+L
band EDFA and Raman Amplifier will highlight how a compact,
low-loss DGE can greatly reduce accumulated gain error,
eliminate dynamic gain ripple and lower the noise figure.
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Molex
will demonstrate its coherent module capable to achieve 400G
transmission and low power consumption. Performances under 16-QAM
modulation at 60G baud rates will be shown in real-time for critical
parameters.
Molex will also participate in speaking engagements:
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In a session organized by the Consortium for On-Board Optics (COBO),
Molex's Tom Marrapode will join other COBO members presenting on
topics related to on board optical modules. This will include
development in systems and sub-systems discussing both electrical and
optical interconnects. The session
will take place Wednesday, March 6, 2019 from 10:15-11:45AM in Theater
II, Hall E.
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Molex's Tom Strasser will teach the ever popular foundational course
on Reconfigurable
Networks, SC 261: ROADM (News - Alert) Technologies and Network Applications on
Monday, March 4, 2019.
Molex joins other Optical Internetworking Forum (OIF) members
attending OFC 2019 to showcase interoperability of Common Electrical
Interface (CEI) solutions over a range of channel reaches and
modulations. Live technology demonstrations featuring Molex solutions
include:
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Cables with Connector/Cage and Cables Demo
A baseline
draft of the CEI 112G LR Implementation Agreement has been developed.
This demonstration, which establishes early stage feasibility for this
topology, utilizes Molex's QSFP-DD (Double Density) passive copper
cable.
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CEI-112G-VSR SerDes with Module demo incorporates multiple
silicon supplier products operating over a 112 Gbps PAM-4 VSR
(chip-to-module) link. This demo utilizes Molex's QSFP-DD, a
CEI-112G-VSR interface, to electrically drive interoperating HCB/MCB
test boards.
Please visit the Molex booth at OFC 2019 or https://www.connector.com/solutions/ofc
to explore a robust portfolio of next-generation, high-speed,
high-density optical solutions. To learn more about how you can become a
part of the Molex innovation, please visit booth 5349 in the Career Zone.
About Molex:
Molex brings together innovation and technology to deliver electronic
solutions to customers worldwide. With a presence in more than 40
countries, Molex offers a full suite of solutions and services for many
markets, including data communications, consumer electronics, medical,
industrial, automotive, and commercial vehicle. For more information,
please visit www.molex.com.
Molex Resources:
Molex is a registered trademark of Molex, LLC in the United States of
America and may be registered in other countries; all other trademarks
listed herein belong to their respective owners.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190305005316/en/
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