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Intrinsyc Announces Immediate Availability of Premium-Tier System on Module based on Qualcomm Technologies' SDA835VANCOUVER, British Columbia, Feb. 21, 2019 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX: ITC and OTCQX: ISYRF) (“Intrinsyc” or the “Company”), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 835 µSOM (micro System on Module) and Development Kit. Intrinsyc’s Open-Q™ 835 µSOM is an ultra-compact (50mm x 25mm) production-ready embedded computing module that is ideal for powering premium performance IoT devices. It is powered by the Qualcomm® SDA835 system on chip (SoC) from Qualcomm Technologies, Inc. “Intrinsyc’s Open-Q™ 835 µSOM is Intrinsyc’s most advanced embedded computing module; enabling the highest combination of computing performance, thermal efficiency and power optimization,” said Cliff Morton, Vice President, Solutions Engineering, Intrinsyc. “Next-generation premium-tier IoT devices, like VR/AR head-mounted displays, IP cameras, enterprise tablets, medical imaging systems, and other devices will benefit from this high-performance production-ready computing module.” “We are happy to see Intrinsyc’s new micro-SOM product powered by Qualcomm Technologies’ SDA835,” said Jeffery Torrance, vice president, business development, Qualcomm Technologies, Inc. “Qualcomm Technologies is driving the Internet of Things forward with offering the best possible connectivity solutions, and we are proud to enable a bright future of IoT devices along with Intrinsyc.” Open-Q™ 835 µSOM Specifications:
https://www.intrinsyc.com/computing-platforms/open-q-835-usom/ To help IoT device makers accelerate time to market, Intrinsyc provides the Open-Q™ 835 µSOM Development Kit, as well as turnkey product development services, driver and application software development, technical support, and documentation. Intrinsyc’s Open-Q 835 µSOM Development Kit is a full-featured development platform including the software tools and accessories required to immediately begin development. The development kit marries the production-ready Open-Q™ 835 µSOM with a carrier board providing numerous expansion and connectivity options to support the development and testing of a wide variety of peripherals and applications, ensuring the fastest time to market possible. The Development Kit is available for purchase at https://shop.intrinsyc.com/products/open-q-835-usom-development-kit. Contact Intrinsyc at [email protected] with your product requirements and have one of the Company’s solution architects help plan for your successful product development and launch. ABOUT INTRINSYC TECHNOLOGIES CORPORATION For more information, please contact: Intrinsyc and Open-Q and their respective logos are trademarks, registered and otherwise, of Intrinsyc Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions. Qualcomm, Kryo, Adreno, Hexagon, Quick Charge, and Spectra are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, Qualcomm Spectra, Qualcomm Artificial Intelligence Engine, Qualcomm Quick Charge and Qualcomm Neural Processing SDK are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners. © Intrinsyc Technologies Corporation all rights reserved |