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Mentor extends solutions to support TSMC 5nm FinFET and 7nm FinFET Plus process technologiesWILSONVILLE, Ore., Oct. 3, 2018 /PRNewswire/ -- Mentor, a Siemens business, today announced certification for TSMC's 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platforms. In addition, Mentor continues to expand features of both the Xpedition™ Package Designer and Xpedition Substrate Integrator products supporting TSMC's advanced packaging offerings. "TSMC is working closely with Mentor, which continues to increase its value to the TSMC ecosystem by offering more features to its EDA solutions in support of our new 5nm and 7nm FinFET Plus processes," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "Mentor has been a strategic partner for many years, and with Siemens' continued strategic investments in Mentor's electronic design automation (EDA) technologies, they are helping our mutual customers be even more successful in bringing to market the next generation of amazing IC innovations." Mentor Calibre nmPlatform for TSMC 5nm and 7nm FinFET Plus Mentor's Caliber YieldEnhancer tool is certified for TSMC's 5nm and 7nm FinFET Plus processes. Mentor and TSMC developed unique fill routines, which achieve manufacturing requirements by tightly controlling the location of the fill shapes. The combination of the Calibre YieldEnhancer tool's capabilities and TSMC's Calibre Fill Design Kit maximize the insertion rate. The Calibre PERC™ reliability platform is not only certified for TSMC's 5nm and 7nm FinFET Plus processes, it has newly enhanced TSMC-developed PERC constraint checks to enable TSMC's customers to improve the reliability of their designs. Mentor's enhanced tools for TSMC's InFO_MS stacking technology Mentor AFS Platform for TSMC 5nm FinFET and 7nm FinFET Plus "Mentor is proud to collaborate with TSMC to continue to deliver linchpin technologies so in turn our customers can bring to market IC innovations more quickly," said Joe Sawicki, executive vice president for Mentor's IC Segment. "This year, TSMC and Mentor are jointly delivering solutions that provide our mutual customers with an expanding number of design avenues so they can quickly deliver ICs for the mobile, high-performance computing, automotive, AI and IoT/wearable markets." Contact for journalists Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world's most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: http://www.mentor.com. Mentor Graphics, Mentor, Calibre, Xpedition, Analog FastSPICE, AFS, 3DSTACK, PERC, xACT, and YieldEnhancer are trademarks or registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owner.
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