TMCnet News
Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012 - 2016) and Opportunity Assessment (2017 - 2027)LONDON, Feb. 14, 2018 /PRNewswire/ -- Download the full report: https://www.reportbuyer.com/product/5328074 Underfill segment to maintain status quo throughout the period of assessment The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives. Edge bonds to significantly contribute to the growth of the underfill segment Underfill segment is further categorized into edge bonds and capillary fills sub segments. Of these, the edge bonds sub segment is expected to largely contribute to the market share of the parent segment. This sub segment is estimated to reach valuation of about US$ 165 Mn growing at a high value CAGR of 6.9% during the forecast period. Edge bonds technology is expected to be growing at this high CAGR owing to their low cost, fast processing and better rework ability. Edge/Corner bonding improves the mechanical reliability performance of the board. The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period. Download the full report: https://www.reportbuyer.com/product/5328074 About Reportbuyer Reportbuyer is a leading industry intelligence solution that provides all market research reports from top publishers For more information: Sarah Smith Research Advisor at Reportbuyer.com Email: [email protected] Tel: +1 (718) 213 4904 Website: www.reportbuyer.com View original content:http://www.prnewswire.com/news-releases/electronic-circuit-board-level-underfill-material-market-global-industry-analysis-2012---2016-and-opportunity-assessment-2017---2027-300598839.html SOURCE ReportBuyer |