TMCnet News
Tensilica and mimoOn Partner to Provide the Only Comprehensive LTE and LTE-Advanced Hardware-Software PHY IP SolutionNov 28, 2012 (M2 PRESSWIRE via COMTEX) -- Tensilica®, Inc., and mimoOn today announced a tight partnership to provide designers with the only comprehensive hardware/software licensable IP solution for LTE (Long-term evolution) and LTE-Advanced chip designs. Through an agreement between mimoOn and Tensilica, Tensilica is now the exclusive DSP IP vendor for mimoOn's LTE UE (user equipment) and eNodeB (base station) physical layer (PHY) software products. The two companies have been working together and demonstrated joint LTE solutions at the Mobile World Congress show for the past three years. mimoOn's mi!SmallCellPHY(TM), mi!MobilePHY(TM), and mi!SmallCellSTACK LTE eNodeB Protocol Stack(TM) software products (see http://www.mimoon.de/pages/Products/ for more information) have been optimized for Tensilica's ConnX Baseband Engine (BBE) family and ConnX DPU IP cores (see http://www.tensilica.com/products/comms_dsp for more information). Customers will also have access to mimoOn's complete LTE software portfolio, product support and design services, which helps customers reduce risk and shorten time-to-market, while allowing a high degree of product differentiation. "This agreement is powerful," stated Will Strauss, President of Forward Concepts and leading DSP analyst. "mimoOn is very well respected for their software, and Tensilica is already providing their DSPs for LTE designs. Now any company looking to enter the LTE or LTE-Advanced market can be assured of a comprehensive hardware/software solution." "Having a complete SW PHY ported on a subsystem of cores is the only way to ensure that the IP cores and subsystem will perform well. In collaboration with our partner mimoOn, Tensilica can provide a complete hardware/software PHY solution. By working closely together, we can not only assure our customers that our IP Cores and LTE Subsystem have the right performance for LTE/LTE-A signal processing and control tasks but also help our customers get chips to market much faster and with the lowest power/area for LTE and LTE-Advanced communications," stated Jack Guedj, Tensilica's president and CEO. "mimoOn has been the leader for LTE PHY by providing the industry's most comprehensive licensable software IP and design support services for mobile handsets and wireless infrastructure. " "Tensilica has become our IP partner of choice based on the quality and the low power/area of their DSP IP cores and the interest we've seen in the marketplace for their hardware solutions," stated Dirk Friebel, CEO of mimoOn. "Their BBE family of DSP and function specific DPU cores is ideally suited for both handsets and base stations, bringing a low-power, highly programmable solution to market." About mimoOn mimoOn GmbH, headquartered in Duisburg, Germany, is a leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile terminals, small cells (Pico/Femto) and IP development in the areas of advanced PHY algorithms on multi-core SDR platforms, SON, schedulers and radio resource management. mimoOn provides a complete porting, optimization and verification service, as well as a roadmap to future 3GPP releases. For more information, please visit http://www.mimoon.de. About Tensilica Tensilica, Inc. is the leader in dataplane processor IP cores, with almost 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com. Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners. ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to [email protected]. |