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Huawei Plans to Adopt HiSilicon Chip for High-end Smartphone
[July 31, 2012]

Huawei Plans to Adopt HiSilicon Chip for High-end Smartphone


SHENZHEN, Jul 31, 2012 (SinoCast Daily Business Beat via COMTEX) -- Huawei Technologies Co., Ltd. will significantly change its mobile phone chip strategy in 2013, a top executive of Huawei says.

Huawei will mainly adopt chips developed by HiSilicon Technologies Co., Ltd. for its high-end smart phones in the future. It is reckoned that at least four types of Huawei's high-end smart phone processors will be applied with HiSilicon chips and HiSilicon LTE chips.



Huawei now has connections with five chip platforms of Qualcomm Inc. (NASDAQ:QCOM), Texas Instruments Incorporated (NYSE: TXN), MediaTek Inc. and HiSilicon Technologies, the top executive adds.

Huawei's strategy in the future is mentioned as follows: HiSilicon platform for high-end products; Qualcomm platform for mass products; Texas Instruments platform not for new mobile phone models any longer and MediaTek platform for dual-card and dual-standby products.


Since 2011 when the company began launching self-branded mobile phones, Huawei has established eight design centers all over the world. It has also established joint laboratories with Microsoft Corporation (NASDAQ: MSFT) and Qualcomm and has been energetically promote its brand image. The company plans to allocate USD 200 million for the promotion of brand image in 2012, according to Taiwan media reports on July 31.

Source: www.c114.net (July 31, 2012)

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