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Corning Incorporated Announces Redemption of Certain 3.50 Percent Convertible Debentures Due 2008
[March 04, 2005]

Corning Incorporated Announces Redemption of Certain 3.50 Percent Convertible Debentures Due 2008


CORNING, N.Y. --(Business Wire)-- March 4, 2005 -- Corning Incorporated (NYSE:GLW) today announced that it will redeem for cash the aggregate principal amount of $100,000,000 of its outstanding 3.50 percent convertible debentures due Nov. 1, 2008 on the redemption date of March 22, 2005. Debentures in an aggregate principal amount of $297,246,000 are currently outstanding. As provided in the indenture governing the convertible debentures, the redemption price is 102 percent per $1,000 principal amount per convertible debenture, together with accrued and unpaid interest to redemption date of March 22, 2005.



In accordance with the indenture, holders retain the right to convert their convertible debentures into Corning common stock at any time before the close of business on the business day immediately preceding the redemption date. The convertible debentures are convertible into 103.3592 shares of Corning common stock for each $1,000 principal amount. No payment will be made for interest accrued and unpaid on debentures surrendered for conversion.

A notice of redemption is being sent to all currently registered holders of the convertible debentures by the trustee for the convertible debentures, JPMorgan Chase Bank, NA. Copies of the notice of redemption and additional information relating to the procedure for redemption may be obtained from JPMorgan Chase Bank, NA by calling 1-800-275-2048.


About Corning Incorporated

Corning Incorporated (www.corning.com) is a diversified technology company that concentrates its efforts on high-impact growth opportunities. Corning combines its expertise in specialty glass, ceramic materials, polymers and the manipulation of the properties of light, with strong process and manufacturing capabilities to develop, engineer and commercialize significant innovative products for the telecommunications, flat panel display, environmental, semiconductor, and life sciences industries.

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