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Research and Markets: Samsung Galaxy SII Camera Module - Samsung 8Mpixel 1.4m BSI CIS Reverse Costing
[March 16, 2012]

Research and Markets: Samsung Galaxy SII Camera Module - Samsung 8Mpixel 1.4m BSI CIS Reverse Costing

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets ( has announced the addition of the "Samsung Galaxy SII Camera Module - Samsung 8Mpixel 1.4m BSI CIS Reverse Costing" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the Samsung Galaxy SII Camera Module.

This camera module integrates a 1.4m pixel CMOS Image Sensor (CIS) ref. S5K3H2Y from Samsung. The CIS die is manufactured using a CMOS architecture with a 90nm process. The CIS uses a Backside Illumination (BSI) architecture. The module integrates a Voice Coil Motor (VCM) auto-focus.

This report provides complete teardown of the camera module with: - Detailed photos - Material analysis - Schematic assembly description - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown - Selling price estimation TOPICS COVERED Glossary Overview/Introduction - Executive Summary - Reverse Costing Methodology Companies Profiles - CMOS Image Sensors - Volume Shipments - Samsung Profile Physical Analysis - Synthesis of the Physical Analysis - Physical Analysis Methodology - Camera Module Views & Dimensions - Camera Module X-Ray - Camera Module Disassembly - CIS Views & Dimensions - CIS Markings - CIS Pads - CIS Microlenses - CIS Pixels - CIS Technology node - Camera Module Cross-section - CIS Cross-section - Physical Data Summary - Short Analyze of Camera Module Version 3 Manufacturing Process Flow - Global Overview - CIS Process Flow - BSI Detailed Process Flow - Description of the CIS Wafer Fabrication Unit Cost Analysis - CIS Front-End : Hypotheses - CIS FEOL + BEOL Cost - CSI BSI Cost - CIS BSI Cost per Process Steps - CIS BSI : Equipment Cost per Family - CIS BSI : Material Cost per Family - CIS Front-End Cost - CIS Back-End 0 : Test & Dicing - CIS Wafer Cost (Front-End + Back-End 0) - CIS Die Cost - Camera Module Assembly - Hypotheses - Optical Module Cost - Auto-Focus Cost - PCB/Housing Cost - Camera Module Cost - Estimated Price Analysis Conclusion For more information visit CONTACT: Research and Markets, Laura Wood, Senior Manager. Fax from USA: 646-607-1907 Fax from rest of the world: +353-1-481-1716 ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at on the world wide web. Inquiries to


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