New Study from StrategyR Highlights a $14.7 Billion Global Market for 3D Semiconductor Packaging by 2026
SAN FRANCISCO, Jan. 18, 2022 /PRNewswire/ -- A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled "3D Semiconductor Packaging - Global Market Trajectory & Analytics". The report presents fresh perspectives on opportunities and challenges in a significantly transformed post COVID-19 marketplace.
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Global 3D Semiconductor Packaging Market to Reach US$14.7 Billion by the Year 2026
Amid the COVID-19 crisis, the global market for 3D Semiconductor Packaging estimated at US$6.6 Billion in the year 2020, is projected to reach a revised size of US$14.7 Billion by 2026, growing at a CAGR of 14.6% over the analysis period. Through Silicon via (TSV), one of the segments analyzed in the report, is projected to grow at a 17.6% CAGR to reach US$8.7 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Package-On-package segment is readjusted to a revised 13.9% CAGR for the next 7-year period. This segment currently accounts for a 24.7% share of the global 3D Semiconductor Packaging market. 3D IC packaging is likely to perform strongly in the 3D TSV segment owing to higher space efficiency and interconnect density in 3D TSVs than other packaging options like 2.5D and 3D WLCSP. The 3D Package on Package (PoP) technology is anticipated to observe high growth, as application processors using advanced innovations depend on small chips that are quick in examining bundled based on the customary setups.
The U.S. Market is Estimated at $1.1 Billion in 2021, While China is Forecast to Reach $4.6 Billion by 2026
Through Glass via (TGV) Segment to Reach $2.2 Billion by 2026
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SOURCE Global Industry Analysts, Inc.
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