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Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™
[February 08, 2024]

Interposer and Fan-out Wafer Level Packaging Market worth $63.5 billion by 2029 - Exclusive Report by MarketsandMarkets™

CHICAGO, Feb. 8, 2024 /PRNewswire/ -- The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% during the forecast period according to a new report by MarketsandMarkets™. The increasing demand for advanced packaging in AI and high-performance computing (HPC) are the key drivers fueling the expansion of the interposer and FOWLP market.


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Interposer and Fan-out Wafer Level Packaging Market Report Scope:

Report Coverage


Market Revenue in 2024

$ 35.6 billion

Estimated Value by 2029

$ 63.5 billion

Growth Rate

Poised to grow at a CAGR of 12.3%

Market Size Available for


Forecast Period


Forecast Units

Value (USD Million/Billion)

Report Coverage

Revenue Forecast, Competitive Landscape, Growth Factors, and Trends

Segments Covered

By Packaging Component & Design, Device, Industry and Region

Geographies Covered

North America, Europe, Asia Pacific, and Rest of World

Key Market Challenge

Complexities in the supply chain

Key Market Opportunities

Integration of advanced electronics in automobiles

Key Market Drivers

Cost advantages offered by advanced packaging


Based on packaging component & design Interposer and Fan-out Wafer Level Packaging market for Interposers to hold the highest market share during the forecast period.

Interposer-based packaging is experiencing robust growth in the semiconductor industry, leveraging its ability to enhance performance and reduce power consumption by facilitating efficient connections between diverse chip components. This technology is increasingly adopted for its role in enabling high-bandwidth and high-performance applications, driving advancements in data centers, 5G infrastructure, and emerging technologies.

Interposer and FOWLP market for the 2.5D packaging segment by packaging type to exhibit the highest market share during the forecast period.

The 2.5D IC packaging market is witnessing significant growth as it enables enhanced performance and miniaturization by stacking multiple chips on an interposer, fostering advancements in high-performance computing, artificial intelligence, and automotive electronics. This packaging approach addresses the demand for improved efficiency, reduced power consumption, and increased bandwidth in a wide range of applications, contributing to its expanding adoption across various industries.

Interposer and FOWLP market for memory devices to hold high market share during the forecast period.

The growth of semiconductor packaging for memory devices is propelled by increasing demand for high-capacity, high-speed memory solutions in applications such as data centers, artificial intelligence, and 5G, driving innovation in packaging technologies to optimize performance and efficiency. Advanced packaging techniques, including 3D stacking and heterogeneous integration, play a crucial role in meeting the evolving requirements of memory devices, enhancing their speed, density, and energy efficiency.

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Interposer and FOWLP market for North America region to hold the second largest share during the forecast period.

North America commands the second-largest share in the interposer and FOWLP industry owing to several key factors. The region is home to a highly developed technological landscape, with a substantial presence of major players in the semiconductor packaging industry. The North America semiconductor advanced packaging industry is a vital sector driving innovation in electronic devices, characterized by cutting-edge technologies such as 3D packaging and heterogeneous integration to enhance performance and miniaturization. It plays a key role in the region's technology ecosystem, fostering advancements in computing, communication, and various electronic applications.

Key Players

The interposer and FOWLP companies include many major Tier I and II players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), and others. These players have a strong market presence in advanced packaging across various countries in North America, Europe, Asia Pacific and the Rest of the World (RoW).

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