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Hot Off The Wires

MIPS Leverages Siemens' Veloce proFPGA platform to Implement and Make Available Capabilities … 5/30/2023

Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation … 5/29/2023

Parade Introduces 20Gbps USB4/TBT4 & USB 3.2 Type-C Retimers with … 5/24/2023

UL Solutions Laboratory in Taipei Approved for Thunderbolt™ 3 and Thunderbolt™ 4 … 5/23/2023

Aetina to Showcase Its New AI Solutions for Different Vertical Markets at … 5/19/2023

KIOXIA Spotlights Flash Storage Breakthroughs that Bring Innovation to Life at Dell … 5/18/2023

PNY VERTO™ GeForce RTX™ 4060 Family of Graphics Cards; PNY Introduces Latest … 5/18/2023

ECSIPC Announces New Smart Retail, Public Terminal, and Automation Intelligence Industrial Solutions … 5/18/2023

First PCI Express® 6.0 Interposer for OCP NIC 3.0 Devices 5/16/2023

OSS Wins $3.5 Million U.S. Air Force Program for AI … 5/10/2023

Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E … 4/24/2023

Blackmagic Design Announces New DeckLink IP HD 4/16/2023

PNY GeForce RTX™ 4070 12GB VERTO; PNY Introduces Latest 40 Series NVIDIA … 4/12/2023

SANBlaze Releases OCP Testing and Major Updates to NVMe Test Suite 4/11/2023

First PCI Express® 6.0 and CXL EDSFF Interposers 4/4/2023

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