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May 13, 2008

RadiSys and NEI Sign Distribution Agreement to Deliver ATCA Solutions

By Rajani Baburajan, TMCnet Contributor

RadiSys, a company that provides embedded computing solutions globally, signed a distribution agreement with NEI, a provider of server appliance products and services, to deliver Advanced Telecom Computing Architecture (AdvancedTCA (News - Alert), or ATCA) solutions.
The agreement combines RadiSys’ application-ready AdvancedTCA platforms with NEI's integration, support, and service capabilities to deliver competitive ATCA solutions.
The combined strength of RadiSys (News - Alert) and NEI enables the companies to serve telecom equipment manufacturers and service providers who require ATCA solutions for their next-generation communication applications.
NEI’s network appliance solutions simplify and enhance the deployment, management and security of IT infrastructure applications. Headquartered in Canton, Massachusetts, NEI is the appliance partner of many original equipment manufacturers (OEMs), independent software vendors (ISVs) and software integrators across the globe.
RadiSys provides advanced solutions for the communication networking and commercial system markets. Having a number of products such as the embedded boards, application enabling platforms, the OS-9 operating system, and turnkey systems, RadiSys helps OEMs, system integrators, and solution providers to create better products more economically.
“This new relationship is a natural extension of RadiSys’ 20-year philosophy of collaborating closely with ecosystem partners and customers,” said Christian Lepiane, vice president of global sales and service at RadiSys.
“Combining the depth and breadth of our ATCA portfolio, including our integrated 10 GB Ethernet application-ready platform, with NEI’s established reputation for ATCA and NEBS frame-level design, integration, and testing as an integral element of its dedicated technical services and support team, will help our mutual customers achieve their time-to-market business imperatives,” Lepiane added.
“We’re partnering with RadiSys for three key reasons,” said Hugh Kelly, NEI senior vice president of marketing. “First, our respective capabilities are uniquely aligned with ATCA market needs. Second, partnering with RadiSys, the ATCA market leader, is in line with NEI’s commitment to offering our customers best-in-class solutions.”
“And, finally, we already have an extensive experience with ATCA-based solutions because NEI served, and continues to serve, the customers of Intel’s (News - Alert) former modular communications platform business which RadiSys acquired in 2007,” Kelly concluded. “This means that we will hit the ground running.”
According to Lee Doyle, group vice president of market researcher IDC (News - Alert), a global provider of market intelligence, the agreement is aptly made in the current market that offers a lot of growth opportunities within the ATCA space.
Rajani Baburajan is a contributing editor for TMCnet. To read more of Rajani’s articles, please visit her columnist page.

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