Wifi Revolution

Rayspan Corporation, the provider metamaterial air interface solutions, has announced that licensees of its technologies have shipped nearly 800,000 devices equipped with more than five million metamaterial antennas, in the first three quarters of 2008. The applications supported by these advanced wireless communications products are Wi-Fi wireless LANs, laptop PCs, and mobile phones.

 

"This rapid growth to extremely high volumes across a broad range of markets establishes the technical and commercial superiority of Rayspan and its unique metamaterial air interface solutions. We are today the only company in the world to have successfully developed and commercialized metamaterials technology for wireless communications, and we intend to maintain this leadership through advanced research and development, constant product innovation and aggressive first-to-market capabilities,” said Franz Birkner, Rayspan president and CEO.

 

“Going forward, we will broaden our array of solutions to include not only antennas but also entire RF front-ends offering true superiority in miniaturization, cost effectiveness and performance improvement," Birkner added.

 

Rayspan has been innovating and implementing metamaterials technology since 2006, providing solutions for the wireless communications air interface. As standards have proliferated to include 3/4G cellular, Wi-Fi MIMO, GPS, Bluetooth, WiMAX (News - Alert) and UWB, the air interface presents some of the difficult system integration problems in the wireless industry.

 

These standards need multiple radio bands and also multiple channels within bands. With the size and spacing needed for the antennas and RF components, it is very difficult  to achieve compact mobile terminal size however, wireless performance objectives are achieved.

 

Rayspan's metamaterial air interface solutions solve these problems, allowing compact, multi-band MIMO wireless terminals with good performance. Metamaterial solutions from Rayspan have a single and multi-band antennas and arrays with complementary directional couplers, power combiners and power splitters.

 

 

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