[August 13, 2018]

3D TSV Devices: Worldwide Market Analysis & Forecast 2018-2023 - ResearchAndMarkets.com

The "Global 3D TSV Devices Market - Growth, Trends and Forecast (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.

The 3D TSV devices market is expected to register a CAGR of 6.88%, over the forecast period 2018-2023.

Driven by the rising demand for novel, high-performance chip architectures featuring advantages such as greater performance, power utilization, and form factor features, 3D TSV technology is making healthy progress in the semiconductor industry.

The development in the 3D TSV advanced wafer packaging technology market is presently fuelled by factors, such as strong outlook for the Information & Communication Technologies (ICT) sector, extension in communication services provider (CSP (News - Alert)) operations, demand for advanced packaging, intensified activity in corporate data centers, and increasing propagation of cloud computing services.

Key Highlights

• Consumer Electronics to Witness Significat Growth Over the Forecast Period
• China to Hold the Largest Market Share in Asia-Pacific
• Adoption of Cloud-based Storage and Cloud Computing by Enterprises to Drive the Market Over the Forecast Period

• May 2017 - Amkor (News - Alert) Technology acquired Nanium SA, a manufacturer of WLFO technology. The acquisition is aimed at strengthening Amkor in the fast-growing market of wafer-level packaging for smartphones, tablets, and other applications.

Key Topics Covered

1. Introduction

2. Executive Summary

3. Market Overview

4. Market Dynamics

5. Global 3D TSV Devices Market Segmentation

6. Vendor Market Share Analysis

7. Competitive Intelligence - Company Profiles

• Amkor Technology, Inc. (US)
• Globalfoundries (US)
• Invensas Corporation (US)
• Iwate Toshiba (News - Alert) Electronics Co. Ltd. (Japan)
• Micron Technology, Inc. (US)
• Samsung Electronics Co. Ltd. (South Korea)
• SK Hynix Inc. (South Korea)
• Sony Corporation (Japan)
• STATS ChipPAC Ltd. (Singapore)
• Taiwan Semiconductor (News - Alert) Manufacturing Company Limited (TSMC) (Taiwan)
• Teledyne DALSA Inc. (Canada)
• Tezzaron Semiconductor Corp. (US)
• United Microelectronics Corporation (UMC) (Taiwan)
• Xilinx (News - Alert) Inc. (US)

8. Investment Analysis

9. Future of the Market

For more information about this report visit https://www.researchandmarkets.com/research/nbh28p/3d_tsv_devices?w=4

View source version on businesswire.com: https://www.businesswire.com/news/home/20180813005285/en/

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