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System-in-Package (SiP) Technology Markets: 2018-2022 Global Strategic Business Report - Flip Chip Type of Interconnection Technology Leads SiP Technology MarketDUBLIN, July 12, 2018 /PRNewswire/ -- The "System-in-Package (SiP) Technology - Global Strategic Business Report" report has been added to ResearchAndMarkets.com's offering. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a six-year historic analysis is provided for these markets.
End-Use Sector
The report profiles 51 companies including many key and niche players such as:
Key Topics Covered 1. INDUSTRY OVERVIEW Consumer Electronics Sector Fuels Revenue Growth in SiP Market Portable Electronic Devices Stir Demand for Flat Packaging 2.5D IC Packaging Technology Dominates SiP Market Challenges Confronting the SiP Market 2. MARKET TRENDS & GROWTH DRIVERS Importance of SiP Technology in Electronics Rising Demand for High Performance and Compact Consumer Electronics Drive Growth List of Select SiP Solutions for Connected Devices Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP Growing Sales of Smartphones Bode Well for SiP Market Growing Demand for Tablet PCs A Key Growth Driver Applications in Set Top Boxes Boosts Demand for SiP Technology Computing Devices A Key Growth Driver IoT Opens New Growth Avenues for SiP TSVs for Die-to-Die/Die-to-Package Substrate Communication Advanced Nodes Demand Innovative Package Technologies PCB Considerations Vital for Using SiP in IoT Systems WLCSP for Compact Form Factors Trend Towards Smart Homes Offers Growth Opportunities Miniaturization of Electronics A Major Growth Driver for SiP Need for Compact and High Speed Performance Products Spurs Market Growth Shift in Direction towards More Than Moore's Law Benefits the SiP Market SMBs Spur the Adoption of SiP Expanding Applications in Non- Battery Operated Systems Spur Market Growth SoC Design Complexities Bring Focus onto SiP Combined SoC and SiP Technology Gains Increased Demand Need to Reduce Cost Per Function of ICs Boosts Market Demand Advanced SiP Packaging Transforming System-Level Integration Landscape Wafer-Based Advanced SiP Laminate-based Advanced SiP SiP Technology to Impact Fan-In Packaging Platform Foundries Focus on Offering Turnkey Services with System-in- Package Vendors Offer Advanced Capabilities for SiP Design 3. TECHNOLOGY OVERVIEW 4. RECENT INDUSTRY ACTIVITY Amkor Announces Product Qualification for SWIFT Packaging 3D Glass Solutions Collaborates with TE Connectivity Silicon Labs Introduces New Bluetooth SiP Module MediaTek Unveils SoCs for Fitness and Healthcare Devices Intel Launches Intel Curie Module SiP Octavo Systems Launches OSD3358 SiP Device UTAC Collaborates with AT & S MediaTek Unveils New SiP Chipsets JCET Receives Order to Assemble SiP Modules for Apple 5. FOCUS ON SELECT GLOBAL PLAYERS Amkor Technology, Inc. (USA) ASE Group (Taiwan) ChipMOS Technologies Inc. (Taiwan) Fujitsu Limited (Japan) GS Nanotech (Russia) Insight SiP (France) Intel Corporation (USA) Jiangsu Changjiang Electronics Technology Co. Ltd. (China) Kulicke & Soffa Pte Ltd. (Singapore) Nanium S.A. (Portugal) O.C.E. Technology Ltd. (Ireland) Powertech Technologies, Inc. (Taiwan) Renesas Electronics Corporation (Japan) Samsung Electronics Co., Ltd. (South Korea) ShunSin Technology (Zhongshan) Limited (China) Si2 Microsystems Private Limited (India) Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan) STATS ChipPAC Ltd. (Singapore) Unimicron Corporation (Taiwan) 6. GLOBAL MARKET PERSPECTIVE Total Companies Profiled: 51 (including Divisions/Subsidiaries 53)
For more information about this report visit https://www.researchandmarkets.com/research/433n9v/systeminpackage?w=5 Did you know that we also offer Custom Research? Visit our Custom Research page to learn more and schedule a meeting with our Custom Research Manager. Media Contact: Research and Markets SOURCE Research and Markets |