[April 18, 2018] |
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Flexible Printed Circuit Boards - Global Strategic Business Report Analysis 2016-2018 to 2024 - Flex-to-Fit Approach Opens New and Exciting Opportunities - ResearchAndMarkets.com
The "Flexible
Printed Circuit Boards - Global Strategic Business Report"
report has been added to ResearchAndMarkets.com's
offering.
The report provides separate comprehensive analytics for the US, Canada,
Japan, Europe, Asia-Pacific, Latin America, and Rest of World. Annual
estimates and forecasts are provided for the period 2016 through 2024.
Also, a five-year historic analysis is provided for these markets.
This report analyzes the worldwide markets for Flexible Printed Circuit
Boards in US$.
The Global market is further analyzed by the following End-Use
Segments:
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Automotive
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Consumer Electronics
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Industrial
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Others
The report profiles 199 companies including many key and niche
players such as:
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3M (News - Alert) Company (USA)
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BHflex Co. Ltd. (South Korea)
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Career Technology (MFG.) Co. Ltd. (Taiwan)
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Daeduck GDS Co. Ltd. (South Korea)
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Flexcom Inc. (South Korea)
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Flexium Interconnect Inc. (Taiwan)
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Fujikura Ltd. (News - Alert) (Japan)
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Ichia Technologies Inc. (Taiwan)
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Interflex Co. Ltd. (South Korea)
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MFS Technology (Singapore)
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Multi-Fineline Electronix (News - Alert) Inc. (MFLEX) (USA)
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Newflex Technology Co. Ltd. (South Korea)
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Nippon Mektron Ltd. (Japan)
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Nitto Denko Corporation (Japan)
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SIFlex Co. Ltd. (South Korea)
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Sumitomo Electric (News - Alert) Industries Ltd. (Japan)
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Xiamen Hongxin Electron-Tech Co. Ltd. (China)
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Zhen Ding Technology Holding Limited (ZDT) (Taiwan)
Key Topics Covered
1. Industry Overview
2. Market Trends and Growth Drivers
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Inherent Product Advantages Fuel Market Growth
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Key Benefits of Flexible Circuits
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Superior Packaging Flexibility
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Key Attribute of FPCs Expanding Applications Market
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Circuit Designing Evolves as End Product Developers Seek
Miniaturization
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Thinner Materials Witness Tremendous Adoption to Realize Smaller
Geometries
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Flex-to-Fit Approach Opens New and Exciting Opportunities
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Customer Requirements Drive Innovations for Substrate Manufacturers
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New Designing Tools Improve Competitiveness of Rigid-Flex Circuits
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Key to High-Frequency Application
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Increasing Laminate Material Choice Poses Fabrication Challenges;
Additives Comes to Rescue
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Stretchable Circuits Garner Significant Interest as Novel
Interconnection Alternative
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Material and Design Advancements Enable Stretchable Interconnects in
Flexible Circuits
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Recent Technological Advances in Flex Circuits
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New Technology (News - Alert) Takes Flexible Circuits to New Level
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Technological Advances thwart Material Limitations for Transparent
Flex Circuits
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Super-Thin Nanoscale Circuits Promise Tremendous Computing Power, Open
New Design Possibilities
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Chemically Doped Nanotubes Emulate Silicon Circuits in Handling Power
Fluctuations
3. Application Markets
4. Product Overview
5. Product Launches/Introductions
6. Recent Industry Activity
7. Focus on Select Global Players
8. Global Market Perspective
Total Companies Profiled: 199 (including Divisions/Subsidiaries
- 214)
The United States (61)
Canada (6)
Japan (10)
Europe (65)
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France (4)
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Germany (21)
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The United Kingdom (18)
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Italy (6)
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Rest of Europe (16)
Asia-Pacific (Excluding Japan) (69)
Middle East (3)
For more information about this report visit https://www.researchandmarkets.com/research/bdmnv7/flexible_printed?w=4
View source version on businesswire.com: https://www.businesswire.com/news/home/20180418005707/en/
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