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Complete Teardown of Sensirion's SGP30 Gas Sensor - 2018 Report - ResearchAndMarkets.comThe "SGP30 Gas Sensor from Sensirion Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering. This report analyzes Sensirion's entire component, including the package, MEMS, and ASIC die developed by the company. It also provides a full description of the ASIC and MEMS functionalities, and details the manufacturing processes used. Sensirion, a leading manufacturer of digital microsensors and systems, recently released a gas sensor designed for consumer and appliance applications: the SGP30 Multi-Pixel. The SGP30 gas sensor is a new kind of sensor which measures different gas types in any environment. With a DFN package volume under 5.5 mm3, this gas sensor can be embedded in a variety of low-power systems, including smartphones, tablets, and laptops. Boasting an innovative design based on metal oxide technology, the SGP30 is Sensirion's first multi-gas sensor. Enclosed in a small DFN 2.45 x 2.45 mm molded package, this sensor can be embedded in virtually any low-power system. Sensirion's Multi-Pixel technology focuses on detecting different gases like CO2 and VOCs on a common membrane, using multiple metal-oxide in the same component. To reduce the component size, Sensirion plced the gas sensor above the ASIC and packaged it with the same mold compound, gaining certain advantages like a reduced number of bonds, and an increased signal-to-noise ratio. With specific material and layout choices, the SGP30 embeds the heater and electrodes within the ASIC. Despite the high current and temperature generated, signal measurement is preserved from these disturbances. The electrode and heater are managed by the ASIC, which includes a temperature sensor for measuring the membrane's temperature, along with flash memory for data calibration. A complete cost analysis and estimated sales price for the SGP30 gas sensor is included too, along with a comparison between ams' AS-MLV-P2, ams's CCS801 and Bosch's BME680 gas sensor.* Key Topics Covered: 1. Overview /Introduction 2. Sensirion - Company Profile 3. Physical Analysis Physical Analysis Methodology Sensor Package View and dimensions Package Opening Sensor Package Cross-Section MEMS/ASIC Die View, Dimensions, and Markings Cross-Section: Metal Layers, Transistor, Capacitor Die Metal De-processing Die Delayering, Main Block ID, and Process Die-Process Characteristics Comparison with ams and Bosch 4. Manufacturing Process Flow Wafer Fabrication Unit Front-End Process Final Assembly Unit 5. Cost Analysis Cost Analysis Overview Main Steps Used in the Economic Analysis Yield Hypotheses ASIC Front-End Cost MEMS Front-End Cost Back-End Cost Packaging Cost Component Cost 6. Selling Price Companies Mentioned
For more information about this report visit https://www.researchandmarkets.com/research/q7f8rc/complete_teardown?w=4 View source version on businesswire.com: http://www.businesswire.com/news/home/20180312005495/en/ |
