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Oclaro Samples Industry's First Ultra High-Bandwidth 1310nm DFB-MZ PICs for Select 100G/400G PAM4 ApplicationsSAN JOSE, Calif., March 6, 2018 /PRNewswire/ -- Oclaro, Inc. (NASDAQ: OCLR), a leading provider and innovator of optical communications solutions, today announced it is sampling the industry's first family of high-bandwidth 1310nm photonic integrated circuits (PICs) that integrate a DFB laser with a Mach Zehnder modulator for intra-data center applications using CWDM wavelengths. Leveraging Oclaro's proven expertise in 1310 DFB lasers for shorter-reach applications with its Indium-Phosphide high-bandwidth modulator technology, this new family of chips will enable higher-speed connectivity across data center campuses. The 1310nm DFB-MZ PIC has been engineered to address the most challenging configurations where high bandwidth and optical signal purity are critical to overcome potential fiber and connector impairments. This product complements Oclaro's full suite of Indium Phosphide DML and EML lasers, all specifically designed to address data center single-mode fiber infrastructure requirements. "The need for ever-increasing capacity within the data center is making it critical to develop higher-speed and more integrated component technology," said Beck Mason, President of Oclaro's Integrated Photonic Business. "Oclaro has a long history of delivering proven direct detect and coherent technology and we are pleased to be the first supplier to now offer a 1310nm DFB-MZ PIC capable of supporting the demanding 100 Gbps per wavelength PAM4 applications." /p>
About the 1310nm DFB-MZ Photonic Integrated Circuits Oclaro's family of DFB-MZ chips are sampling today with volume production expected by July 2018. About Oclaro Copyright 2018. All rights reserved. Oclaro, the Oclaro logo, and certain other Oclaro trademarks and logos are trademarks and/or registered trademarks of Oclaro, Inc. or its subsidiaries in the US and other countries. All other trademarks are the property of their respective owners. Information in this release is subject to change without notice. Media Contact Info:
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