Teledyne LeCroy Interviewed on VIP Stage at Embedded World 2018

NUREMBERG, Germany, Feb. 27, 2018 /PRNewswire/ -- Teledyne LeCroy, the worldwide leader in embedded test solutions, today announced that Albert Hanselmann, managing director of Teledyne LeCroy Deutschland GmbH, will be interviewed on the Markt & Technik VIP Stage at the Embedded World 2018 exhibition and conference in Nuremberg, Germany. The interview, which will cover Teledyne LeCroy's solutions to the test and measurement challenges posed by advanced embedded applications, takes place at 10:20 on Wednesday, February 28 at the Exhibition Centre.

Hanselmann will discuss how embedded technologies present a daunting array of technical challenges to test and measurement platforms. Applications such as the Internet of Things, Industry 4.0, vehicle autonomy, and electromobility demand that system designers and integrators not only be well-versed in a broad palette of technologies, but also highly adaptable to change as these technologies rapidly evolve. Next-generation embedded systems comprise high-speed serial data, low-speed serial buses, myriad sensors, embedded computing, and wireless transceivers, among other challenges. To fully debug and validate systems of such complexity, test and measurement solutions must bridge the gap between hardware and software teams, addressing both the physical and protocol layers with tools that reveal the dependencies between them.

In his interview, Hanselmann will describe how Teledyne LeCroy's test and measurement solutions address these difficult technical challenges. Teledyne LeCroy oscilloscopes feature up to eight analog input channels, 12-bit vertical resolution, mixed-signal capabilities, and optional 24-channel sensor-acquisition modules to enable greatly detailed capture of many high- and/or low-speed serial signals, power-rail signals, power-electronics signals, and sensor signals. They are available in high bandwidths and provide general-purpose, 1-M? probe inputs, supported by a broad array of probe types with a standard interface. The instruments provide a comprehensive set of tools for causal relationship analysis, including serial trigger/decode, measure/graph, eye diagrams, pass/fail analysis, and jitter analysis.

All oscilloscopes team with a full range of low- and high-speed serial-bus software packages for comprehensive measurement and analysis of embedded serial protocols such as CAN, UART, SPI, USB, and I²C, among many others. Higher-bandwidth instruments also support complete DDR2/3/4 compliance testing and debug. Probes and software packages also support power-integrity and digital power-management analysis, both increasingly critical aspects off embedded-system design. The end result is faster time-to-insight for debugging and validation of all embedded system designs.

About Teledyne LeCroy
Teledyne LeCroy is a leading manufacturer of advanced oscilloscopes, protocol analyzers, and other test instruments that verify performance, validate compliance, and debug complex electronic systems quickly and thoroughly. Since its founding in 1964, the Company has focused on incorporating powerful tools into innovative products that enhance "Time-to-Insight". Faster time to insight enables users to rapidly find and fix defects in complex electronic systems, dramatically improving time-to-market for a wide variety of applications and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy's website at teledynelecroy.com.

About Teledyne Technologies Incorporated
Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems.  Teledyne Technologies' operations are primarily located in the United States, the United Kingdom, Canada, and Western and Northern Europe.  For more information, visit Teledyne Technologies' website at www.teledyne.com.

About Embedded World 2018
From security for electronic systems, distributed intelligence, and the Internet of Things to e-mobility and energy efficiency, the Embedded World trade fair highlights innovations from the embedded sector. The exhibition features more than 1,000 exhibitors and numerous speakers from 42 countries presenting the entire spectrum of embedded technology – ranging from construction elements through modules and full systems, operating systems, hard and software to services – to more than 30,000 trade visitors and approximately 1,700 conference participants from 73 countries. For more information, visit www.embedded-world.de.

© 2018 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice.

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