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Intrinsyc Technologies Corporation (TSX:ITC and OTC:ISYRF) Announces Hardware Development Kit Featuring Qualcomm Snapdragon 845 Mobile Platform, Providing Innovative Architectures for Artificial Intelligence and ImmersionVANCOUVER, British Columbia, Feb. 20, 2018 (GLOBE NEWSWIRE) -- Intrinsyc Technologies Corporation (TSX:ITC) (OTC:ISYRF) (“Intrinsyc”), a leading developer of intelligent connected devices, today announced the general availability of a new Hardware Development Kit (“HDK”) featuring the Qualcomm® Snapdragon™ 845 Mobile Platform, a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. The Snapdragon 845 Mobile Platform introduces new, innovative architectures for artificial intelligence (“AI”) and immersion. The Snapdragon 845 utilizes Qualcomm Technologies’ cutting-edge wireless heterogenous compute expertise to design a platform for immersive multimedia experiences including eXtended reality (XR), on-device AI, lightning-fast connectivity, and introduces new secure processing unit (SPU) designed to deliver vault-like security for premium, flagship mobile devices. To support the ecosystem of technology companies and application providers looking to utilize the advanced features of the Snapdragon 845, Intrinsyc Technologies Corporation is introducing the Open-Q™ 845 HDK. The HDK is an open-frame solution that empowers technology companies to integrate and innovate for devices based on the latest Snapdragon mobile platform, as well as provide original equipment manufacturers (“OEMs”), developers and engineers with next generation software technology and tools to accelerate development and testing of devices. It includes all of the software tools and accessories required to immediately begin development work. The HDK is a full featured Android development platform that provides an ideal starting point for creating high-performance mobile devices and applications. Open-Q™ 845 Hardware Development Kit Specifications: Snapdragon 845 Mobile Platform with Qualcomm® Kryo™ 385 CPU (Four performance cores up to 2.8GHz -Four efficiency cores up to 1.8GHz), Qualcomm® Adreno™ 630 GPU, Secure Processing Unit, and Qualcomm® Hexagon™ 685 DSP
“The Snapdragon 845 Mobile Platform pushes the boundaries of computing and power performance; with innovations in immersive multimedia, artificial intelligence, and security,” said Victor Gonzalez, Vice President, Engineering of Intrinsyc. “We are very excited to offer early access to a comprehensive development kit allowing technology companies and connected device makers to accelerate their product development using the powerful and innovative Snapdragon 845 Mobile Platform.” Users of the Open-Q™ 845 development kit will receive product documentation and access to complimentary tools and software updates, and additional technical support or product development assistance through Intrinsyc’s technical support services. The Open-Q™ 845 Development Kit is available to order at https://shop.intrinsyc.com/products/open-q-845-development-kit About Intrinsyc Technologies Corporation For more information, please contact: Intrinsyc and Open-Q are trademarks of Intrinsyc Technologies Corporation. Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Bluetooth is a registered trademark of Bluetooth SIG, Inc. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Other products or brand names may be trademarks or registered trademarks of their respective owners. |