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Top 3 Drivers of the Global Electronic Design Automation Market | TechnavioTechnavio market research analysts forecast the global electronic design automation market is expected to exceed USD 11 billion by 2022, according to their latest report. This press release features multimedia. View the full release here: http://www.businesswire.com/news/home/20180117006070/en/ 
Technavio has published a new market research report on the global electronic design automation market 2018-2022 under their hardware and semiconductor library. (Graphic: Business Wire) The report further segments the global electronic design automation market by type (on-premise solutions and cloud-based solutions), by product (semiconductor IP, CAE, IC physical design and verification, PCBs and MCMs, and services), and by geography (the Americas, APAC, and EMEA). This report is available at a USD 1,000 discount for a limited time only: View market snapshot before purchasing Buy 1 Technavio report and get the second for 50% off. Buy 2 Technavio reports and get the third for free. Technavio analysts highlight the following three market drivers that are contributing to the growth of the global electronic design automation market:
Looking for more information on this market? Request a free sample report Technavio's sample reports are free of charge and contain multiple sections of the report including the market size and forecast, drivers, challenges, trends, and more. Growing design complexity to improve functionality The semiconductor market is defined by the need for high functionality, performance, and bandwidth. Thus, semiconductor device manufacturers should enhance their offerings in terms of performance and functionality. They must also ensure that they maintain the time to market to gain an advantage over their competitors. The increasing complexity of semiconductor chip designs has further increased the manufacturing complexity. According to a senior analyst at Technavio for semiconductor equipment research, "The features and functionalities provided by consumer electronic devices are increasing as electronic device manufacturers are concentrating on differentiating their offerings. Semiconductor device manufacturers have addressed this need by developing new and more complex architectures and designs such as the advent of 3D architecture and MCMs." Rising adoption of SoC technology The use of SoCs has increased significantly over the last five years. Several smart electronics manufacturers have started integrating this technology into their devices such as wireless communication equipment, electrocardiogram (ECG), smartphones, telemetry devices, and automotive body electronics. In addition, due to the emergence of system-in-package (SiP) technology, mixed-signal SoC manufacturers can integrate more functionalities onto a single chip. The launch of 4G networks in several countries such as India and China has resulted in the deployment of long-term evolution technology (LTE (News - Alert)). This technology has a significant impact on the smart devices market, leading to exponential growth of smartphones, tablets, and wearables with 3G and 4G connectivity. Design for high-precision, miniaturized electronic devices There is an increase in the demand for compact electronic devices from almost all sectors, including communication devices, automotive, industrial manufacturing, and healthcare equipment. This has encouraged semiconductor IC manufacturers to increase their R&D expenditure to reduce the size of the ICs and enhance their performance. This has led to the emergence of MEMS and 3D semiconductor devices. ICs have become denser over the last decade. MEMs and 3D ICs have an increasing number of interconnects and transistors integrated into them. These ICs require finer deposition and patterning. Chip manufacturers have migrated from planar field-effect transistor designs to fin-shaped FET architecture designs. Browse Related Reports:
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