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Global Next-Generation Memory Market 2017-2023 by Technology (Volatile (HMC and HBM), and Nonvolatile (MRAM, FRAM, RERAM, 3D XPoint, NRAM)), Wafer Size (200 mm, 300 mm, and 450 mm), Application - Research and MarketsThe "Next-Generation Memory Market by Technology (Volatile (HMC and HBM), and Nonvolatile (MRAM, FRAM, RERAM, 3D XPoint, NRAM)), Wafer Size (200 mm, 300 mm, and 450 mm), Application, and Geography - Global Forecast to 2023" report has been added to Research and Markets' offering. The NGM market is expected to reach USD 9.68 billion by 2023 from USD 2.35 billion in 2017, at a CAGR of 26.54% between 2017 and 2023. The growth of this market can be attributed to the increasing enterprise storage application; demand for universal memory devices; need for high bandwidth, low power consumption, and highly scalable memory device for technologies such as artificial intelligence (AI), Internet of Things (IoT), and big data. However, the lack of stability under extreme environmental conditions, and issues with storage in niche application and high cost of emerging memories acting as restraints for the NGM market. This report covers the following types of next-generation memory technologies volatile memory and nonvolatile memory. Nonvolatile memory held a larger share of the NGM market in 2016. Nonvolatile memories such as ReRAM and STT-MRAM PCM offer better sped and enhanced performance compared to that provided by volatile memory devices, such as DRAM and SRAM, along with the higher storage densities. This report segments the market on the basis of application into consumer electronics, enterprise storage, and industrial, among others. Enterprise storage held the largest market share in 2016, owing to increasing need for data storage capabilities in cloud storage and data centers in enterprise storage. This market has been segmented on the basis of wafer size into 200 mm, 300 mm, and 450 mm. 300 mm wafer held the largest market share in 2016. Currently, 300 mm wafer holds a larger share of the market than 200 mm wafer as 300 mm wafer can accommodate double dice per wafer as compared to 200 mm wafer and result in 2-4% lower IC cost/cm per year. Key Topics Covered: 1 Introduction 2 Research Methodology 3 Executive Summary 4 Premium Insights 5 Market Overview 6 Next-Generation Memory Market, By Technology 7 Next-Generation Memory Market, By Application 8 Next-Generation Memory Market, By Wafer Size 9 Geographic Analysis 10 Competitive Landscape 11 Company Profiles
For more information about this report visit https://www.researchandmarkets.com/research/srtjmf/nextgeneration View source version on businesswire.com: http://www.businesswire.com/news/home/20171206005678/en/ |
