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Mercury Systems Ships Defense Industry's First BuiltSecure DDR4 High Density Secure Memory DeviceANDOVER, Mass., Nov. 09, 2017 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ:MRCY) (www.mrcy.com) announced that it has shipped the defense industry’s first BuiltSecure™ high density secure memory devices manufactured with double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM). The Company’s first BuiltSecure DDR4 product embeds 8GB of high-speed DDR4 memory in an ultra-compact 13 by 20 millimeter ball grid array (BGA) package optimized for reliability in harsh military environments. A leading supplier of defense microelectronics is currently integrating Mercury’s DDR4 devices into a next-generation computing system for a military avionics command, control and intelligence application. Delivering space savings of 75% compared to discrete memory devices, Mercury’s three-dimensional packaging technology transforms a planar array of nine discrete DDR4 devices into a single, SWaP-efficient and vertically integrated BuiltSecure device delivering DDR4 performance over an extended operating temperature range of -55 to +125 °C. With a height less than 2.5 millimeters, the new devices are ideally suited for placement on the backside of a printed circuit board, thereby freeing valuable real estate on the front side of the board for placement of additional active and passive components needed to further enhance system performance. “After announcing our DDR4 design program in March of this year, we received a tremendous response from defense prime contractors in need of highly miniaturized and ruggedized DDR4 memory solutions with data transfer rates up to 2666 MB/s,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Leveraging our 15 year heritage in microelectronics packaging, we successfully accelerated our DDR4 development program to align our first product shipment with the needs of this critical military program’s schedule.” Mercury’s entire portfolio of BuiltSecure high density secure memory devices are designed and manufactured in its Defense Microelectronics Activity (DMEA) trusted Advanced Microelectronics Center located in Phoenix, Ariz.For long-term supply continuity, critical components are acquired from carefully selected supply chain partners with manufacturing sites located within the United States. As a testament to its commitment for excellence in security across all aspects of its business, Mercury protects its design and manufacturing records with an active cybersecurity program based on the Center for Internet Security (CIS) critical security controls. For application assistance, more information on Mercury’s BuiltSecure DDR4 high density secure memory devices or to participate in Mercury’s design program, visit www.mrcy.com/ddr4 or contact Mercury at (866) 627-6951 or [email protected]. Mercury Systems – Innovation That Matters™ Forward-Looking Safe Harbor Statement Contact: Mercury Systems, BuiltSecure and Innovation That Matters are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders.
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