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TE Connectivity Showcases Connector and Cable Assembly Solutions at Supercomputing 17HARRISBURG, Pa., Nov. 9, 2017 /PRNewswire/ -- TE Connectivity (TE), a world leader in connectivity and sensors, will showcase a comprehensive lineup of high-performance connectors, sockets, cable assemblies, and power solutions at the Supercomputing 17 (SC17) conference to be held in Denver, Colorado November 13-16. TE will show its innovative solutions in the Ethernet Alliance booth (#843) and the Gen-Z Consortium booth (#992) throughout the show, and TE experts will be on hand to explain how TE products enable the high-speed connectivity for next-generation supercomputing applications. TE will showcase the following products: I/O connectors: microQSFP, zSFP+, and zQSFP+, 28G, 100G and 200G interconnects, OSFP and QSFP-DD 400G interconnects, as well as thermally enhanced versions of all these interconnects. "Ethernet performance continues to advance, and it's encouraging to see the industry, through organizations like TE, keeping pace with the change," said John D'Ambrosia, chairman of the Ethernet Alliance. "We are delighted to have TE joining us in our operating demo at Supercomputing 17 as we point the way forward in high-speed data." "The Gen-Z Consortium is continuing our efforts toward creating a next generation interconnect that bridges existing solutions while enabling unbound innovation," said Kurtis Bowman, President of the Gen-Z Consortium. "TE's connectivity products are a key element to our scalable connector strategy and forthcoming specification release, helping our open standards forum achieve its technology goals. We look forward to showcasing TE Sliver interconnects at Super Computing 2017." "Big data and other high-demand applications require the highest performance, and TE continually strives to push performance to new heights," said Eric Himelright, Vice President, Product Management at TE Connectivity. "We are excited to be exhibiting at Supercomputing 17." ABOUT TE CONNECTIVITY TE Connectivity, TE, TE connectivity (logo), STRADA Whisper, Sliver, ChipConnect, MULTI-BEAM HD, Z-PACK and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. View original content with multimedia:http://www.prnewswire.com/news-releases/te-connectivity-showcases-connector-and-cable-assembly-solutions-at-supercomputing-17-300553255.html SOURCE TE Connectivity |