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Asetek to Showcase its Data Center Liquid Cooling Technology at SC17OSLO, Norway, Nov. 9, 2017 /PRNewswire/ -- Asetek® (ASETEK.OL) today announced it will showcase HPC Liquid Cooling solutions at SC17 in Denver, Colorado November 13-16. Liquid cooling from recently announced OEMs and channel partners will be on display in addition to cooling solutions for the latest Intel, Nvidia and IBM CPUs, accelerators and GPUs. The flexibility of Asetek's cooling architecture will be highlighted with a variety of heat rejection options for HPC clusters and data centers featured. Also on display a will be a new cooling technology for data centers where "computing blocks" of servers share a rack mounted HEX. "We are seeing higher wattage HPC nodes that require liquid cooling as they cannot be cooled with air. Wattage density is only going to get higher with the inclusion of machine learning and AI across the HPC spectrum," said John Hamill, Asetek Chief Operating Officr. Asetek liquid cooling solutions for HPC data centers include RackCDU D2C (Direct-to-Chip), and ServerLSL (Server Level Sealed Loop). RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. ServerLSL provides liquid assisted air cooling for server nodes, replacing less efficient air coolers and enabling the servers to incorporate the highest performing CPUs and GPUs. Appointments for in-depth discussions about Asetek's data center liquid cooling solutions at SC17 may be scheduled by sending an email to [email protected]. About SC17 About Asetek This information was brought to you by Cision http://news.cision.com Media Contact: View original content:http://www.prnewswire.com/news-releases/asetek-to-showcase-its-data-center-liquid-cooling-technology-at-sc17-300553249.html SOURCE Asetek |