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DesignCon 2018 Announces Full Conference Schedule, New Boot Camp Seminars, Opportunity to Earn IEEE AccreditationSANTA MONICA, Calif., Nov. 9, 2017 /PRNewswire/ -- DesignCon 2018, the nation's premier conference for chip, board and systems design engineers, today announced its full conference agenda featuring over 100 technical sessions spanning the latest developments in hardware and high-speed communications design, full-day boot camp seminars designed to give attendees working knowledge on critical industry topics and the addition of IEEE accreditation opportunities. The three-day conference covers all aspects of electronic design and is curated by the Technical Program Committee (TPC), which is comprised of over 90 electronic design experts from organizations including IBM, Raytheon and Samsung. DesignCon 2018 takes place January 30 - February 1, 2018, at the Santa Clara Convention Center in Santa Clara, CA. To apply for a media pass, please click here. "As our longtime attendees can attest, DesignCon is a community-driven event—everything from our conference sessions to our deep-dive boot camps to our networking opportunities are created with the needs of today's electrical engineer in mind," said Nina Brown, vice president of events, UBM. "This year's conference is no different. We're very fortunate to have the insight of over 90 brilliant electronic design experts shaping the content of DesignCon 2018, and I'm confident that both new and returning attendees will find this year's programming highly compelling." The 2018 agenda features 14 conference tracks covering system co-design, optimizing high-speed serial design,applying test and measurement methodology, modeling and analysis of interconnects and more. In total, attendees will have access to over 100 technical sessions led by experts from the likes of Cisco, Intel, Oracle and Qualcomm. Sample technical sessions include:
Complementing the technical sessions are three full-day boot camps, which take deep dives into core introductory principles on electronic design and engineering. The boot camps, taking place from 9:00 AM- 4:30 PM on Tuesday, January 30, can be utilized as crash courses into notable industry topics such as high-speed serial design, pragmatic signal integrity and test & measurement techniques. Additionally, for the first time, DesignCon 2018 will offer continuing education units from the Institute of Electrical and Electronics Engineers (IEEE) for all sessions attended, giving attendees the opportunity to work toward an official IEEE certificate. IEEE accreditation helps professionals stand out to employers, maintain engineering licenses and meet training requirements. Register for DesignCon 2018: To register for the event please visit: designcon.tech.ubm.com To apply for a media pass please visit: designcon.tech.ubm.com/2018/index/registrations/media DesignCon Social Media About DesignCon
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