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Global Narrowband IoT Chipset Market 2017-2021: Increasing Adoption of M2M Communications - Research and Markets
[October 09, 2017]

Global Narrowband IoT Chipset Market 2017-2021: Increasing Adoption of M2M Communications - Research and Markets

The "Global Narrowband IoT Chipset Market 2017-2021" report has been added to Research and Markets' offering.

The global narrowband IoT chipset market is forecast to grow at a CAGR of 60.85% during the period 2017-2021.

The report, Global Narrowband IoT Chipset Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors operating in this market.

Market Trends:

  • Deployment of the NB-IoT technology in airports
  • Growth of smart cities
  • Integration of the NB-IoT technology with cloud computing
  • Adoption of the NB-IoT technology in the healthcare industry

One of the major drivers for this market is Increasing adoption of M2M communication. M2M communication is the communication that is required for the exchage of information between devices without any manual assistance. Sensors are integrated into a machine, and these sensors are used to obtain data and record information. The NB-IoT technology is steadily replacing the conventional M2M channel technologies, such as Bluetooth, DSL, and WLAN, for applications (including smart meters and smart parking) that require low data rates and long-range connectivity.

The M2M connections required for smart meters, smart parking, smart agriculture, and smart buildings have low data rates. Therefore, they require a technology that has been built to support low data rates. The NB-IoT technology, therefore, is an ideal choice; it works at low data rates (10s of kbps) and also in the 200 kHz spectrum. NB-IoT modules also have a battery life of 10 years.

Key vendors

  • Ericsson (News - Alert)
  • Huawei Technologies
  • Intel
  • Nordic Semiconductor
  • Sequans
  • U-blox

Key Topics Covered:

Part 01: Executive Summary

Part 02: Scope Of The Report

Part 03: Research Methodology

Part 04: Introduction

Part 05: Market Landscape

Part 06: Market Segmentation By Application

Part 07: Market Segmentation By Deployment Type

Part 08: Regional Landscape

Part 09: Decision Framework

Part 10: Drivers And Challenges

Part 11: Market Trends

Part 12: Vendor Landscape

Part 13: Key Vendor Analysis

Part 14: Appendix

For more information about this report visit

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