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Global Semiconductor Assembly Equipment Market 2017-2021 - Key vendors are ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron & Tokyo Seimitsu - Research and Markets
[July 07, 2017]

Global Semiconductor Assembly Equipment Market 2017-2021 - Key vendors are ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron & Tokyo Seimitsu - Research and Markets


Research and Markets has announced the addition of the "Global Semiconductor Assembly Equipment Market 2017-2021" report to their offering.

The analysts forecast the global semiconductor assembly equipment market to grow at a CAGR of 3.57% during the period 2017-2021.

Global Semiconductor Assembly Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

The latest trend gaining momentum in the market is growing use of 3D packaging technology. Foundries are using 3D packaging technology to meet the demands of electronic device manufacturers.

These manufacturers are focusing on reducing the space occupied by ICs in their devices without compromising on power-saving capabilities. 3D packaging involves the stacking of mutiple chips in a single stack, thereby utilizing the least possible space in a device.



One of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of assembly equipment is usually in the range of $100,000-1,000,000.

Key vendors


  • ASM (News - Alert) Pacific Technology
  • Kulicke & Soffa Industries
  • Palomar Technologies
  • Tokyo Electron
  • Tokyo Seimitsu

Other prominent vendors

  • Besi
  • ChipMOS TECHNOLOGIES
  • DIAS Automation
  • Greatek Electronics
  • Hesse Mechatronics
  • Hybond
  • Shinkawa
  • Toray Engineering
  • West - Bond

Key Topics Covered:

Part 01: Executive summary

Part 02: Scope of the report

Part 03: Research Methodology

Part 04: Introduction

Part 05: Technology overview

Part 06: Market landscape

Part 07: Market segmentation by type

Part 08: Market segmentation by end-user

Part 09: Geographical segmentation

Part 10: Key leading countries

Part 11: Decision framework

Part 12: Drivers and challenges

Part 13: Market trends

Part 14: Vendor landscape

Part 15: Appendix

For more information about this report visit https://www.researchandmarkets.com/research/bv2bfx/global


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