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Global Wafer Inspection Equipment Market to Grow at a CAGR of 12.4% by 2021 - Key Vendors are Applied Materials, Hermes Microvision (ASML), KLA-Tencor & Lasec Corporation - Research and Markets
[June 06, 2017]

Global Wafer Inspection Equipment Market to Grow at a CAGR of 12.4% by 2021 - Key Vendors are Applied Materials, Hermes Microvision (ASML), KLA-Tencor & Lasec Corporation - Research and Markets


Research and Markets has announced the addition of the "Global Wafer Inspection Equipment Market 2017-2021" report to their offering.

The global wafer inspection equipment market to grow at a CAGR of 12.49% during the period 2017-2021.

The report, Global Wafer Inspection Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $1,000,000-10,000,000. Therefore, manufacturers look to develop long-standing relations with customers. The utlook is to build long-term relationships with the customers by offering incentives and discounts for future purchases. The targeted segments are the ones that have a tendency to procure equipment in bulk and account for around 5%-10% of the equipment manufacturers global sales.



Key vendors

  • Applied Materials (News - Alert)
  • Hermes Microvision (ASML)
  • KLA-Tencor
  • Lasec Corporation

Other prominent vendors


  • Zeiss Global
  • FEI (Thermo Fisher Scientific)
  • Hitachi (News - Alert) High-Technologies
  • JEOL
  • Lam Research
  • Nanometrics
  • Nikon
  • Planar Corporation
  • Rudolph Technologies
  • Tokyo Seimitsu
  • Toray Engineering

Key Topics Covered:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction

PART 05: Market landscape

PART 06: Market segmentation by technology type

PART 07: Market segmentation by wafer type

PART 08: Market segmentation end-user

PART 09: Geographical segmentation

PART 10: Key leading countries

PART 11: Decision framework

PART 12: Drivers and challenges

PART 13: Market trends

PART 14: Vendor landscape

For more information about this report visit http://www.researchandmarkets.com/research/k689wm/global_wafer


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