[May 19, 2017] |
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System-in-Package (SiP) Technology - Global Strategic Business Report 2017 - Research and Markets
Research and Markets has announced the addition of the "System-in-Package
(SiP) Technology - Global Strategic Business Report" report to
their offering.
The report provides separate comprehensive analytics for the US, Canada,
Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and
forecasts are provided for the period 2015 through 2022.
Also, a six-year historic analysis is provided for these markets. Market
data and analytics are derived from primary and secondary research. This
report analyzes the worldwide markets for System-in-Package (SiP)
Technology in US$ Million.
The Global market is further analyzed by:
Interconnection Technology
End-Use Sector
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Consumer Electronics
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Communications
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Aerospace & Defense
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Automotive
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Others
The report profiles 51 companies including many key and niche
players such as
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Amkor Technology, Inc. (USA)
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ASE Group (Taiwan)
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ChipMOS Technologies Inc. (Taiwan)
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Fujitsu (News - Alert) Limited (Japan)
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GS Nanotech (Russia)
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Insight SiP (France)
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Intel Corporation (USA)
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Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
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Kulicke & Soffa Pte Ltd. (Singapore)
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Nanium S.A. (Portugal)
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O.C.E. Technology Ltd. (Ireland)
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Powertech Technologies, Inc. (Taiwan)
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Renesas Electronics Corporation (Japan)
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Samsung Electronics Co., Ltd. (South Korea)
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ShunSin Technology (Zhongshan) Limited (China)
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Si2 Microsystems Private Limited (India)
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Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
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STATS (News - Alert) ChipPAC Ltd. (Singapore)
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Unimicron Corporation (Taiwan)
Key Topics Covered:
1. INDUSTRY OVERVIEW
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Small Form Factor, High Performance & Energy Efficiency Needs of
Electronics Industry Bolster Demand for System-in-Package (SiP)
Technology
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Growing Demand for Miniature and High Performance Electronic Devices &
Systems Drive SiP Market
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Developing Countries Offer Growth Prospects
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Flip Chip Type of Interconnection Technology Leads SiP Technology
Market
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Consumer Electronics Sector Fuels Revenue Growth in SiP Market
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Portable Electronic Devices Stir Demand for Flat Packaging
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2.5D IC Packaging Technology Dominates SiP Market
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Challenges Confronting the SiP Market
2. MARKET TRENDS & GROWTH DRIVERS
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Importance of SiP Technology in Electronics
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Rising Demand for High Performance and Compact Consumer Electronics
Drive Growth
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List of Select SiP Solutions for Connected Devices
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Growing Demand for Smart, Energy Efficient Electronics Provides
Business Case for SiP
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Growing Sales of Smartphones Bode Well for SiP Market
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Growing Demand for Tablet PCs
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Applications in Set Top Boxes Boosts Demand for SiP Technology
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Computing Devices
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IoT Opens New Growth Avenues for SiP
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TSVs for Die-to-Die/Die-to-Package Substrate Communication
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Advanced Nodes Demand Innovative Package Technologies
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PCB Considerations Vital for Using SiP in IoT Systems
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WLCSP for Compact Form Factors
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Trend Towards Smart Homes Offers Growth Opportunities
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Miniaturization of Electronics
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A Major Growth Driver for SiP
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Need for Compact and High Speed Performance Products Spurs Market
Growth
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Shift in Direction towards More Than Moore's Law Benefits the SiP
Market
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SMBs Spur the Adoption of SiP
3. TECHNOLOGY OVERVIEW
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System in Package (SiP): A Definition
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SiP Configurations, Features and Target Applications
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Development of SiP
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SiP Packaging
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Package-on-Package SiP
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Power Quad Flat No-Lead SiP
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Stacked Die SiP
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System-in-Package Land Grid Array
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SiP Benefits
4. RECENT INDUSTRY ACTIVITY
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Amkor (News - Alert) Announces Product Qualification for SWIFT Packaging
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3D Glass Solutions Collaborates with TE Connectivity
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Silicon Labs Introduces New Bluetooth SiP Module
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MediaTek (News - Alert) Unveils SoCs for Fitness and Healthcare Devices
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Intel Launches Intel® Curie Module SiP
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Octavo Systems Launches OSD3358 SiP Device
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UTAC Collaborates with AT & S
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MediaTek Unveils New SiP Chipsets
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JCET Receives Order to Assemble SiP Modules for Apple
5. FOCUS ON (News - Alert) SELECT GLOBAL PLAYERS
6. GLOBAL MARKET PERSPECTIVE
Total Companies Profiled: 51 (including Divisions/Subsidiaries 53)
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The United States (16)
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Japan (3)
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Europe (8)
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- France (4)
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- Rest of Europe (4)
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Asia-Pacific (Excluding Japan) (25)
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Middle East (1)
For more information about this report visit http://www.researchandmarkets.com/research/zbp5vs/systeminpackage
View source version on businesswire.com: http://www.businesswire.com/news/home/20170519005238/en/
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