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2017 Silicon on Insulator Market by Wafer Size, Wafer Type, Technology, Product, Application - Global Forecast to 2022 - Research and MarketsResearch and Markets has announced the addition of the "Silicon on Insulator Market by Wafer Size, Wafer Type, Technology, Product, Application - Global Forecast to 2022" report to their offering. The SOI market is expected to grow at a CAGR of 29.1% between 2017 and 2022, to reach USD 1,859.3 million by 2022 The key driving factors for the growth of the SOI market are the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices. However, the major restraints for the growth of this market are the lack of available IP ecosystem and the floating body effect. 200 mm is currently the most popular SOI wafer size in the market. 200 mm is the diameter of the SOI wafer. Currently, virtually all the RF chips, including 2G, 3G, and 4G, are manufactured by using 200 mm SOI wafers. In other words, almost all the smartphones make use of200 mm SOI wafers. Soitec (France) is a leading player in the 200 mm market and holds more than 50% of the market share. Soitec has developed the smart cut technology, which is the major technology for manufacturing 200 mm SOI wafers. The smart cut technology is expected to hold the largest share of the overall SOI market between 2017 and 2022. Smart cut is Soitec's proprietary wafer bonding and layer splitting technology. Soitec (France) developed the smart cut technology in collaboration with CEA-Leti (microelectronics research lab). This technology involves the implantation of light ions and wafer bonding for transferring ultrathin single-crystal layer from one substrate to another. APAC expected to be the fastest-growing region in the SOI market during the forecast period The key players operating in the SOI market are
For more information about this report visit http://www.researchandmarkets.com/research/fszt9z/silicon_on
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