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DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers
[April 18, 2017]

DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers

SAN FRANCISCO, April 18, 2017 /PRNewswire/ -- DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit:  

The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation. 

"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."

Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:

Chip-Level Design

Characterizing and Selecting the VRM

Steve Sandler, Picotest

Board/System-Level Design

FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter

Yunhui Chu, Intel Corporation

Alaeddin Aydiner, Intel Corporation

Kai Xiao, Intel Corporation

Beomtaek Lee, Intel Corporation

Dan Oh, Samsung Electronics

Oleg Mikulchenko, Intel Corporation

Adam Norman, Intel Corporation Rob Friar, Intel Corporation

Charles Phares, Intel Corporation

Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard

Heidi Barnes, Keysight Technologies

José Moreira, Advantest

Manuel Walz, Advantest

RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology

Masashi Shimanouchi, Intel Corporation

Hsinho Wu, Intel Corporation

Mike Peng Li, Intel Corporation

Serial Link Design

Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE

Jan B. Preibisch, Technische Universität Hamburg-Harburg

Torsten Reuschel, Technische Universität Hamburg-Harburg

Katharina Scharff, Technische Universität Hamburg-Harburg

Jayaprakash Balachandran, Cisco Systems Inc.

Bidyut Sen, Cisco Systems Inc.

Christian Schuster, Technische Universität Hamburg-Harburg

Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links

Yuhan Yao, Oracle Corporation

Xun Zhang, Oracle Corporation

Dawei Huang, Oracle Corporation

Jianghui Su, Oracle Corporation

Muthukumar Vairavan, Oracle Corporation

Chai Palusa, Oracle Corporation

PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link

Mohammad S. Mobin, Broadcom Ltd

Haitao Xia, Broadcom Ltd

Aravind Nayak, Broadcom Ltd

Gene Saghi, Broadcom Ltd

Christopher Abel, Broadcom Ltd

Lane Smith, Broadcom Ltd

Jun Yao, Broadcom Ltd

Power & RF Design

Cost-effective PCB Material Characterization for High-volume Production Monitoring

Yongjin Choi, Hewlett-Packard Enterprise

Christopher Cheng, Hewlett-Packard Enterprise

Yasin Damgaci, Hewlett-Packard Enterprise

Nagaraj Godishala, Hewlett-Packard Enterprise

Yuriy Shlepnev, Simberian

Overview and Comparison of Power Converter Stability Metrics

Joseph 'Abe' Hartman, Oracle

Alejandro 'Alex' Miranda, Oracle

Kavitha Narayandass, Oracle

Alexander Nosovitski, Oracle

Istvan Novak, Oracle

RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices

Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group

Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group

Jiheon Yu, Samsung Electronics Mobile Division, HE Group

Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group

Seyoon Cheon, Samsung Electronics Mobile Division, HE Group

NamSeok Oh, Samsung Electronics Mobile Division, HE Group

Dong Sub Kim, Samsung Electronics Mobile Division, HE Group

To view the entire list of recipients, including individual researchers, please visit: 

DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30- February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year's event, visit:

Follow DesignCon online:, @UBMDesignCon,

About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit

About UBM Americas 
UBM Americas, a part of UBM plc, is the largest business-to-business events and trade show organizer in the U.S. Through a range of aligned interactive physical and digital environments, UBM Americas increases business effectiveness for both customers and audiences by cultivating meaningful experiences, knowledge and connections. UBM Americas has offices spanning North and South America, and serves a variety of specialist industries with dedicated events and marketing services covering everything from fashion, tech and life sciences to advanced manufacturing, cruise shipping, specialty chemicals, powersports and automotive, concrete, hospitality, cargo transportation and more. For more information, visit:


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