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DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers
[April 18, 2017]

DesignCon Celebrates More than 40 Professionals with 2017 Awards for Best Papers


SAN FRANCISCO, April 18, 2017 /PRNewswire/ -- DesignCon, the premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities, announces the recipients of its Best Paper Awards following a successful DesignCon 2017 in Santa Clara, CA, on January 19-21. The winners are recognized for their outstanding contribution to the diverse educational goals of DesignCon. To view the full list of winners, visit: http://ubm.io/2pvrEHk  

The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation. 

"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."

Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:



Chip-Level Design

Characterizing and Selecting the VRM


Steve Sandler, Picotest



Board/System-Level Design

FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter


Yunhui Chu, Intel Corporation


Alaeddin Aydiner, Intel Corporation


Kai Xiao, Intel Corporation


Beomtaek Lee, Intel Corporation


Dan Oh, Samsung Electronics


Oleg Mikulchenko, Intel Corporation


Adam Norman, Intel Corporation Rob Friar, Intel Corporation


Charles Phares, Intel Corporation



Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard


Heidi Barnes, Keysight Technologies


José Moreira, Advantest


Manuel Walz, Advantest



RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology


Masashi Shimanouchi, Intel Corporation


Hsinho Wu, Intel Corporation


Mike Peng Li, Intel Corporation



Serial Link Design

Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE


Jan B. Preibisch, Technische Universität Hamburg-Harburg


Torsten Reuschel, Technische Universität Hamburg-Harburg


Katharina Scharff, Technische Universität Hamburg-Harburg


Jayaprakash Balachandran, Cisco Systems Inc.


Bidyut Sen, Cisco Systems Inc.


Christian Schuster, Technische Universität Hamburg-Harburg



Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links


Yuhan Yao, Oracle Corporation


Xun Zhang, Oracle Corporation


Dawei Huang, Oracle Corporation


Jianghui Su, Oracle Corporation


Muthukumar Vairavan, Oracle Corporation


Chai Palusa, Oracle Corporation



PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link


Mohammad S. Mobin, Broadcom Ltd


Haitao Xia, Broadcom Ltd


Aravind Nayak, Broadcom Ltd


Gene Saghi, Broadcom Ltd


Christopher Abel, Broadcom Ltd


Lane Smith, Broadcom Ltd


Jun Yao, Broadcom Ltd



Power & RF Design

Cost-effective PCB Material Characterization for High-volume Production Monitoring


Yongjin Choi, Hewlett-Packard Enterprise


Christopher Cheng, Hewlett-Packard Enterprise


Yasin Damgaci, Hewlett-Packard Enterprise


Nagaraj Godishala, Hewlett-Packard Enterprise


Yuriy Shlepnev, Simberian



Overview and Comparison of Power Converter Stability Metrics


Joseph 'Abe' Hartman, Oracle


Alejandro 'Alex' Miranda, Oracle


Kavitha Narayandass, Oracle


Alexander Nosovitski, Oracle


Istvan Novak, Oracle



RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices


Antonio Ciccomancini Scogna, Samsung Electronics Mobile Division, HE Group


Hwanwoo Shim, Samsung Electronics Mobile Division, HE Group


Jiheon Yu, Samsung Electronics Mobile Division, HE Group


Chang-Yong Oh, Samsung Electronics Mobile Division, HE Group


Seyoon Cheon, Samsung Electronics Mobile Division, HE Group


NamSeok Oh, Samsung Electronics Mobile Division, HE Group


Dong Sub Kim, Samsung Electronics Mobile Division, HE Group




To view the entire list of recipients, including individual researchers, please visit: http://designcon.com/santaclara/conference/paper-award-winners 

DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30- February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year's event, visit: designcon.com

Follow DesignCon online: facebook.com/DesignCon, @UBMDesignCon, flickr.com/photos/designcon

About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

About UBM Americas 
UBM Americas, a part of UBM plc, is the largest business-to-business events and trade show organizer in the U.S. Through a range of aligned interactive physical and digital environments, UBM Americas increases business effectiveness for both customers and audiences by cultivating meaningful experiences, knowledge and connections. UBM Americas has offices spanning North and South America, and serves a variety of specialist industries with dedicated events and marketing services covering everything from fashion, tech and life sciences to advanced manufacturing, cruise shipping, specialty chemicals, powersports and automotive, concrete, hospitality, cargo transportation and more. For more information, visit: www.ubmamericas.com

 

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/designcon-celebrates-more-than-40-professionals-with-2017-awards-for-best-papers-300440651.html

SOURCE UBM Americas


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