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Worldwide IC Packaging Market: 2016 Edition - Research and MarketsResearch and Markets has announced the addition of the "The Worldwide IC Packaging Market 2016 Edition" report to their offering. The Worldwide IC Packaging Market, 2016 Edition provides in-depth analysis of semiconductor devices and the IC packaging industry. Using extensively researched historical and current market trend data, the report examines the global IC packaging market, providing 5-year forecasts from a number of perspectives, including packaging type, I/O count, and application. Integrated circuits are beyond question one of the most significant inventions of the 20th Century. Billions of ICs are manufactured every year, and are used in a vast range of products. In 2015, nearly 380 billion ICs were manufactured and shipped by semiconductor companies across the globe, and over the next five years, it is expected that the market will expand at a compounded annual growth rate of more than 4%. Forecasts are provided for unit shipments, annual revenues and packaging pricing for 31 separate IC device types, a well as 14 major packaging categories comprised of 44 market segments. The report also includes an economic and major product overview of the global electronics industry, as well as a focused analysis of the Outsourced Semiconductor Assembly and Test (OSAT) industry segment. Key Topics Covered: Chapter 1: Introduction Chapter 2: Executive Summary Chapter 3: Economic Outlook and Worldwide Chapter 4: IC Packaging Market Analysis by Semiconductor Device Chapter 5: IC Packaging Overview and Total Chapter 6: OSAT Market and Strategy Analysis Companies Mentioned
For more information about this report visit http://www.researchandmarkets.com/research/jbxdxk/the_worldwide_ic
View source version on businesswire.com: http://www.businesswire.com/news/home/20161207005590/en/ |
